Sysmax was incorporated July 1989 to provide automated wafer process equipment to the semiconductor industry. The Sysmax line of products has processed uniformly consistent, quality products at an economically acceptable cost, in a full production capacity as well as a laboratory R & D tool. The repetitive manual operations required in the wafer process are ideally suited for the Sysmax line of standard products to meet these goals.
Sysmax Inc is a manufacturer of automated wafer process and wafer handling equipment for the Semiconductor industry.
Included in our standard line of products are:
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Spin Process System (SPS), the 600 series for processing up to 6" wafers. and the 800
series for up to 8" wafers. The SPS is a stand-alone dual tank wet station with a unique automated rotary agitation and transfer unit to move wafers from tank to tank. The 620 and 810 systems will process 2 boats (25 wafers/boat) of up to 6" wafers per production run. The SPS 810 will also process one (1) boat of 25 8" wafers in a production run. The Systems includes a microprocessor based controller with a color
"touch screen" and a ten (10) process `recipe' programming capability.
Options include controlled heating/cooling in the process etch tank,
recirculation/filtration system, plus other special requirements.
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"Drop-In" Agitation System's, are compact, economical, automated robotic systems retrofittable to existing or new wafer process stations. The SAS or CAS systems for single tank agitation are easily adapted to a confined or head case restricted area.
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CAS
and TAS Transfer Systems for 2, 3, 4, or more tank transfer
agitation process systems.
Controls maybe a simple operator controlled on/off switch by timer, or microprocessor based controller with
touch screen and programming capability. Power source in most cases is single air line with 60-80psi pressure.
Power source in most cases is single air line with 60-80 psi
pressure.
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Vacuum Etch System (VES), The VES is a stand alone automated batch processor, in a vacuum environment for wet chemical etching of wafers. Wafers are etched under vacuum so that hydrogen bubbles, an etching reaction, which causes "snow" and "bridging" are immediately removed from the wafer surface and exhausted by an evacuating pump.
End-point detector and / or microprocessor based controller with
touch screen provide precise etch control.
The system can process two (2) cassettes (25-wafers per
cassettes) of up to 150MM wafers or one (1) cassette of 25
200MM wafers per production run.
This system has been certified to meet the European Union's applicable directives for product compliance.
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Process systems to meet a customer's specific needs. utilizing single and or multiple transfer systems. have been designed
and manufactured as a normal production process.
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In addition to the US market, Sysmax provides and services systems and products to the European and Asian markets.
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