Applications
- Gap Etch
- Silicon Material Removal
- Oxide Etch
- Metal Etch
- Photoresist Develop and Strip
- Substrate cleaning with
Ultrasonics or Megasonics
- HF Dip
- Systems for
Substrates up to 200MM are standard.
And more...
Features
- The Model-SPS produces consistent result by rotating the wafer
cassettes during the process cycles and rapid transfer from the chemistry process
tank to the quench rinse tank.
- Closed loop motor control with encoder provides precise rotational agitation.
- The microprocessor based system with
Touch Screen offers reliable and precise process control.
All operator controls are easily operable and accessible.
- Up to 10 process "recipes" can be programmed through a
touch-screen. A summary of the "recipe" and process information
is displayed on a single screen for easy reference.
- High throughput
- Double containment construction.
- "Fail-Safe" feature when electrical power or N2 pressure is lost.
- Precise control of the chemical both temperature. Two liquid level sensors with Over temperature controller are provided for
fail safe operation.
- All components that come into contact with corrosive liquid are constructed of inert plastic or ore sealed from direct contact.
- Small footprint.
OPERATION
 The
Model-SPS is a dual tank wet station which provides a chemical
processing tank and rinsing tank combination. The operator loads the wafer
cassettes into the carrier assembly, closes the fume door and presses the START button
to initiate the programmed process cycle. The carrier assembly transfers
into the chemical process tank and performs the process with a
continuous rotational agitation for preset time. After completion of the preset process time or if process
RESET is selected, the carrier assembly is rapidly transferred to the rinse tank for the Quench. Quick
Dump-Overflow rinse cycles. When the rinse cycle is completed, the end of the process cycle is signaled by an audible alarm. The carrier assembly continues to spin until the operator presses the RESET button at which time the carrier is moved to the unload position for removal to the drying unit. |
