Modutek’s extensive experience in delivering wet processing equipment allows the company to meet the particular needs of each customer. Its equipment can support a wide variety of wet bench processes and its extensive range of products can be customized to solve specialized problems for particular applications. For silicon wafer strip solutions, the company can deliver equipment to support the following applications:
Silicon Nitride Strip
The silicon nitride strip process removes silicon nitride from silicon wafers containing integrated circuits in a hot acid bath. Key factors for a high quality result are the selectivity of the bath strip solution and the repeatability of the process variables. The selectivity of removing silicon nitride while leaving silicon oxide intact must be high and the process must always deliver the same results for the same inputs.
The Modutek Nb series silicon nitride etch bath monitors bath temperature while adding DI water to maintain the acid to water ratio. The process can be tightly controlled to give excellent consistency resulting in the desired selectivity and the required repeatability.
Modutek offers an advanced ozone cleaning process for photoresist strip without the use of harsh, expensive chemicals. The ozone cleaning process can strip, etch or clean silicon wafers at a lower cost than conventional technology while using an environmentally friendly and safe process.
Oxide Strip (Buffered Oxide Etch – BOE)
The F series filtered sub-ambient circulation bath for BOE applications can cut down on acid consumption while reducing particles and improving yields. Specifically designed for BOE applications, the Modutek F series bath delivers excellent performance with a large number of options available to meet specific process requirements.
Solvent Based Resist Strip
Modutek’s SFa series temperature controlled stainless steel recirculating baths can handle a wide variety of solvents. The baths all meet Class 1 Div 1 Group D requirements and can handle solvents such as IPA, acetone and resist strip solutions. The vessels are 316L electropolished stainless steel designed for long vessel life and operate at a temperature of up to 100 degrees Celsius. Available in a range of sizes as well as with custom dimensions, the baths are designed to handle all solvent applications.
SPM Photo Resist Strip
For photo resist strip using the sulphuric acid / hydrogen peroxide mixture SPM process, the Modutek QFa high temperature recirculation quartz baths are an ideal solution. They feature fast, even heating in a seamless, sloped flange design. Operating temperature range is 30 to 180 degrees Celsius with an approximate heat up rate of 2 degrees per minute. Process temperature control can provide an accuracy of up to plus/minus 1 degree Celsius. The quartz bath vessel is made of boron-free internally flame polished virgin fused quartz and Modutek can supply a wide range of standard and custom sizes.
Wet Processing Strip Solutions
Processing engineers considering various silicon wafer strip solutions can be confident that Modutek can supply the appropriate wet processing equipment for their application. The company has been in operation for over 35 years and provides an extensive product line of semiconductor manufacturing equipment. Their experience and expertise allows them to offer both standard equipment for common applications as well as customized solutions for applications outside the norm.
With Modutek, engineers can choose the wafer strip process they want to use, from conventional SPM, solvent or silicon nitride wet processes to the new advanced ozone technology. They can decide which is the most appropriate for their particular application. Modutek can provide recommendations on the wet processing equipment needed and also offer different options when applicable. For a free consultation or quote on selecting equipment for specific wafer strip applications call Modutek at 866-803-1533 or email Modutek@modutek.com.