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How the Ozone Cleaning Process Supports Green Technology


Editor’s Note: This article was originally published in July 2015 and has been updated with new information and reposted in Sep 2023. With rising environmental consciousness, industries are reevaluating traditional manufacturing methods with adverse ecological impacts. Semiconductor manufacturers who rely heavily on chemical solvents and acids for cleaning face both environmental and safety concerns. However, […]

How the Advanced Ozone Cleaning Process Improves Wafer Yields and Reduces Costs


Editor’s Note: This article was originally published in January 2017 and has been updated with additional information and reposted in April 2023. Modutek’s advanced ozone cleaning is a highly effective method for removing contaminants from wafers. The process involves using ozone gas, which is a highly reactive oxidant, to break down and remove organic and […]

How Advanced Ozone Cleaning Reduces Costs and Improves Wafer Yields


When ozone is used to clean silicon wafers, it reduces the use of aggressive chemicals and it can decrease the wafer particle count. Modutek’s advanced ozone cleaning process can clean more quickly than many chemical-based processes and it delivers other benefits. Ozone is used to remove organic contaminants from wafer surfaces in either the Coldstrip […]

How Advanced Ozone Cleaning Reduces Chemical and Solvent Usage


As environmental concerns mount and regulatory compliance becomes more difficult, companies that reduce the use of hazardous chemicals and solvents will have a competitive advantage. In addition to reducing costs, the use of fewer corrosive chemicals improves workplace safety and can lead to better semiconductor manufacturing facility performance. Modutek’s patented advanced ozone cleaning process saves […]

Using the Advanced Ozone Cleaning Process to Improve Wafer Yields


Two key goals for semiconductor manufacturers are to increase process yields and to reduce chemical usage. Wet process semiconductor manufacturing is sensitive to wafer contamination by microscopic particles that increase final product rejection rates and reduce output quality. The ozone cleaning process can reduce particle counts and improve wafer yields by reducing the number of defective products. […]