Wafer Strip Process
Modutek provides extensive expertise in designing and delivering a full product line of wet processing equipment to meet the needs of customers. The equipment supports a wide variety of wet bench processes which can also be customized to solve problems for specific applications. Modutek provides equipment to support the following silicon wafer strip process applications:
Silicon Nitride Strip
The silicon nitride strip process effectively removes silicon nitride from the surface of silicon wafers in a hot acid bath. The main factors for achieving high quality results are the selectivity of the bath strip solution and the repeatability of the process variables. The selectivity of removing silicon nitride while keeping the silicon oxide intact must be high and the process must consistently deliver the same results for the same inputs. Modutek’s Nb series silicon nitride etch bath supports this process by monitoring bath temperature while adding DI water to maintain the acid to water ratio. The process can be carefully controlled to give excellent consistency resulting in the desired selectivity and the required repeatability.
Oxide Strip (Buffered Oxide Etch – BOE)
Modutek’s F series filtered sub-ambient circulation bath for BOE applications can cut down on the use of acid, reduce particles and improve yields. Specifically designed for BOE applications, the F series bath delivers excellent performance with a lot of options available to meet specific process requirements of customers.
Resist Strip
Modutek provides an advanced ozone cleaning process for photoresist strip that does not require the use of harsh, expensive chemicals. The ozone cleaning process can effectively strip, etch or clean silicon wafers at a lower cost than conventional methods while using an environmentally friendly and safe process.
Solvent Based Resist Strip
Modutek supports solvent based resist strip processes using the SFa series temperature controlled stainless steel recirculating baths. The baths can handle solvents that include IPA, acetone and resist strip solutions and meet all Class 1 Div 1 Group D requirements. The process vessel uses 316L electropolished stainless steel designed for long life and operate up to 100 degrees Celsius. The baths are designed to handle all solvent applications and are available in a range of sizes as well as with custom sizes.
SPM Photo Resist Strip
Photo resist strip using a sulfuric acid / hydrogen peroxide mixture SPM process is supported by Modutek’s QFa high temperature recirculation quartz baths. They provide fast, even heating within a seamless, sloped flange design. The operating temperature range is 30 to 180 degrees Celsius with a heat up rate of approximately 2 degrees per minute. The temperature control of the process can maintained with accuracy of up to +/- 1 degree Celsius. The quartz bath vessel consists of boron-free internally flame polished virgin fused quartz and Modutek can provide a wide range of standard as well as custom sizes.
Wafer Strip Process Solutions
Processing engineers that need to use various wafer strip process applications can be confident that Modutek can supply the appropriate equipment to meet their requirements. With over 35 years of industry experience and expertise, Modutek provides an extensive product line of high quality and reliable wet processing equipment. Contact Modutek for both standard equipment for common wafer strip process applications as well as customized solutions for applications outside the norm.