Category Archives: Silicon Wafer Cleaning Equipment

How Piranha Etch is Used in Silicon Wafer Cleaning

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How Piranha Etch is Used in Silicon Wafer CleaningEditor’s Note: This article was originally published in December 2016 and has been updated with additional information and reposted in March 2023.

Silicon wafers are fabricated with repeated etching and cleaning steps to produce the micro-structures required for the final silicon semiconductor products. Piranha or SPM (sulfuric peroxide mix) solutions can clean organic material from wafers and oxidize most metals. The powerful chemical action that makes it a favorite for resist strip and for cleaning wafers with organic residue also makes it difficult to use. High-quality silicon wafer cleaning equipment designed to handle the corrosive chemicals safely is required for carrying out piranha etch safely and effectively.

What is Piranha Etch and How is it Used

Piranha etch is a highly corrosive mixture of concentrated sulfuric acid (H2SO4) and hydrogen peroxide (H2O2) commonly used in the microelectronics industry to clean and etch silicon wafers. It is called “piranha” due to its aggressive nature, similar to the ferocious piranha fish found in the Amazon River.

The most common ratio is approximately three parts acid to one part peroxide, but solutions of up to seven parts acid to one part peroxide are sometimes used. The solution is highly exothermic and is prepared by slowly adding the peroxide to the acid. The mixture heats up rapidly and is often used at temperatures of around 130 degrees C. Once the operating temperature and the desired concentration are reached, the wet bench equipment must heat the solution to maintain the temperature and keep the etch rate constant.

Piranha etch is primarily used to remove organic and inorganic contaminants from silicon wafers, which can negatively affect the performance of electronic devices. The highly oxidizing nature of hydrogen peroxide and the dehydrating property of sulfuric acid make piranha etch highly effective in removing photoresist residues, heavy metals, and other contaminants that may be present on the surface of silicon wafers. The underlying surfaces are hydroxylated, making them hydrophilic or attractive to water, a characteristic that can be used in subsequent silicon semiconductor manufacturing process steps.

Piranha Etch Process Steps

The process of using piranha etch involves several steps. First, the silicon wafer is rinsed with deionized water to remove loose particles or dust. Then, the wafer is immersed in a piranha etch bath for a short period, typically 10-30 minutes, depending on the level of contamination. During this time, the piranha etch reacts with the contaminants on the wafer, breaking them down and removing them from the surface.

After the piranha etch treatment, the wafer is rinsed several times with deionized water to remove any remaining piranha etch solution. It is important to note that piranha etch is a very dangerous substance and should be handled with extreme caution. The mixture is highly reactive, exothermic and produces toxic fumes that can cause severe burns and respiratory problems. Proper safety equipment, such as gloves, goggles, and fume hoods, should always be used when working with piranha etch.

Spiking the Piranha Solution to Maintain Concentration

When a facility wants to reuse a piranha solution for an extended period, the solution must be spiked with extra hydrogen peroxide. Hydrogen peroxide is unstable in the solution and decomposes, reducing the etching power of the bath. Spiking with additional hydrogen peroxide lets operators use a piranha solution for up to eight hours rather than replacing it every two hours. Spiking saves money by conserving sulfuric acid but requires wet bench equipment to handle the process and the spiking.

Modutek’s Silicon Wafer Cleaning Solutions

Modutek’s wet bench and silicon wafer cleaning equipment provide wafer cleaning solutions. The company can supply standard equipment or customize wet bench solutions to meet specific customer requirements. Priorities are high-quality materials, excellent designs, and low cost of ownership to achieve optimized process results. Piranha wafer cleaning is supported with Modutek’s QFa high-temperature recirculating Quartz Tanks and the QA constant temperature baths. Both can be installed in a wet bench station, and the process can be controlled automatically, semi-automatically, or manually.

The QFa series high-temperature re-circulating Quarz Tanks provide fast even heating over a temperature range of 30 to 180 degrees C. The heat-up rate can be up to 2 degrees C per minute, and the temperature control is up to plus/minus 1 degree C. The quartz bath is made of flame-polished semiconductor-grade quartz insulated with silica fiber rated up to 1260 degrees C.

The QA series constant temperature quartz baths are made from the same materials with the same control characteristics as the QFa series, but they feature a magnetic stirrer, an aspirator valve system, a gravity drain, and a quartz bubbler. Both baths are available in standard sizes or can be custom-made to fit customer requirements.

Modutek’s Equipment Provides Safe and Reliable Operation

Modutek can provide a complete range of silicon wafer cleaning equipment that includes baths suitable for piranha cleaning applications. The equipment is designed with safe and reliable operation in mind, and the cleaning equipment eliminates contaminants and impurities to the greatest extent possible. Modutek’s wet bench equipment allows operators to use piranha cleaning methods safely to increase facility throughput while maintaining or improving output quality. Contact Modutek for a free quote or recommendations on using the right equipment for your wafer cleaning application.

How the Piranha Etch Process Improves Silicon Wafer Cleaning

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While the Piranha solution quickly removes organic residue from silicon wafers, the process is difficult to control and may produce explosive gas mixtures. The Piranha solution is made up of one part hydrogen peroxide and three parts sulfuric acid, although the ratio may vary for specific applications.

The mixture is exothermic and the heat released when the hydrogen peroxide is added to the sulfuric acid drives up the temperature of the solution towards the normal process operating temperature of 130 to 180 degrees centigrade. Both the temperature and the concentration may vary, reducing the useful lifespan of the solution. When the challenge to control temperature and maintain the concentration is met, the Piranha solution can deliver superior silicon wafer cleaning performance.

Spiking the Piranha Solution Can help Maintain Concentration

The hydrogen peroxide in the Piranha solution is not stable and decomposes to produce water. The rate of decomposition is higher the higher the temperature, and the water dilutes the solution. Operators can compensate for the lower concentration by periodically spiking the solution with additional hydrogen peroxide. As hydrogen peroxide is added, the temperature rises, and more hydrogen peroxide decomposes to form water. This interdependence of the concentration with the temperature complicates keeping a tight control on the process, but spiking the Piranha solution lengthens the solution’s lifespan from a few hours to about one day.

Modutek’s “Bleed and Feed” Method Increases the Piranha Solution Lifespan

Modutek has developed an innovative solution to the control and lifespan issues of the Piranha process. The company uses quartz tanks with a “clean” and a “dirty” tank to provide pre-mixed Piranha solution to the active process. Silicon wafer cleaning takes place in the “dirty” tank while the clean tank has a Piranha solution with a programmable concentration. When the concentration of hydrogen peroxide drops in the “dirty” tank, a small amount of the low-concentration solution is drained from the tank and an equal amount is added from the “clean” tank. Instead of the destabilizing spike of hydrogen peroxide, the small but frequent addition of pre-mixed fresh Piranha solution keeps both the concentration and temperature stable and makes possible a tight control of the process, significantly prolonging lifespan.

The “Bleed and Feed” Method Delivers Important Benefits

Modutek’s “Bleed and Feed” method is fully programmable, allowing operators to adapt it to any application to deliver improved silicon wafer cleaning. The concentrations of the “clean” and “dirty” tanks, the amount of the “bleed” and the amount of the “feed” are all independently adjustable so the desired concentrations can be maintained for an extended period. Specific benefits of the “bleed and feed” method include the following:

  • Predictable strip rate because both the temperature and the concentration are tightly controlled.
  • Programmable settings allow a flexible operation.
  • Risk of an explosion from spiking with too much hydrogen peroxide is reduced.
  • Longer solution lifespan results in reduced use of chemicals.
  • Reduced costs for purchase, storage, and disposal of chemicals.
  • Reliable process parameters result in excellent repeatability between batches and accurate maintenance of process variables over extended operation.
  • Reduced downtime because the Piranha solution has to be replaced less often.
  • Safer operation because the process is maintained in a stable equilibrium.

With a more stable Piranha process, silicon wafer cleaning is improved with less contamination and fewer particles. Product defect rates are lower and customers will see higher yields. Overall wet process line performance is improved, with lower costs and better output quality.

Modutek Provides Innovative Solutions for Wet Processing Requirements

Modutek continues to build on its experience in wet process technology and has in house expertise to develop innovative solutions for their customers. The Piranha solution “bleed and feed” method lets customers achieve their production goals more easily. Modutek provides solutions that meet customer needs and ensures that the delivered equipment performs as required. Contact Modutek for a free consultation to discuss the equipment needed to support your specific process requirements.

The Importance of Pre-Diffusion Cleans in Silicon Wafer Cleaning

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The Importance of Pre-Diffusion Cleans in Silicon Wafer CleaningWhen wafer cleaning immediately prior to diffusion is effective, semiconductor manufacturing output is of high quality and the defect rate is reduced. A major pre-occupation of pre-diffusion cleaning is the removal of microscopic particles from the surface of the silicon wafer. Particles can prevent even diffusion and may themselves be diffused into the silicon, causing defects.

Silicon wafer cleaning can be carried out in chemical baths or with megasonic cleaning systems. Several cleaning steps using different processes are sometimes required to get a specific level of cleanliness. The goal is to obtain wafers free from metallic or organic contamination and with as few surface particles as possible. As silicon microstructures are designed with smaller elements and with a higher component density, adequate wafer cleaning becomes more and more critical.

RCA Clean Uses Two Steps to Remove Organic and Metallic Contamination

RCA clean uses ammonium hydroxide, hydrogen peroxide and hydrochloric acid to remove surface contaminants from the silicon wafer. In the Standard Clean 1 (SC1) process, the wafers are placed in a mixture of ammonium hydroxide and hydrogen peroxide. The corrosive mixture removes organic matter but may leave metal ions behind.

In the Standard Clean 2 (SC2) process, the remaining metallic traces are removed by immersing the wafers in a mixture of hydrochloric acid and hydrogen peroxide. At the end of the RCA wafer cleaning process, organic and metallic contamination has been removed while as many remaining particles as possible are rinsed away as well.

Piranha Clean Removes Heavy Organic Contamination

When wafers are heavily contaminated with organic materials such as photo resist, the Piranha process cleans more quickly than RCA clean. The wafers are immersed in a mixture of sulfuric acid and hydrogen peroxide and the mixture may be heated to speed up the reaction. The piranha clean process hydroxilates the wafer surface, making it hydrophilic. This affinity for water is sometimes a useful feature for additional cleaning measures.

Megasonic Cleaning Removes Contaminants and Particles

Megasonic cleaning avoids the use of corrosive chemicals and is especially effective for dislodging microscopic particles from the wafer surface. The Megasonic process works by generating high-frequency sound waves in the cleaning bath. An ultrasonic generator produces the high-frequency electronic signal and a transducer converts the signal into sound waves that travel through the cleaning solution. The sound waves create tiny cavitation bubbles that produce a scrubbing action against the wafer surface. The action of the bubbles cleans the wafer.

Microscopic contaminating particles adhere to the wafer and are difficult to remove. With integrated circuits featuring increasingly smaller geometries, even the tiniest particles can cause defects. Megasonic silicon wafer cleaning operates in the frequency range near or above 1 MHz and the cavitation bubbles agitate the cleaning solution at the operating frequency. Such agitation breaks the bond holding the particle on the wafer surface and the floating particles can be rinsed away.

Modutek Wet Bench Equipment Supports Pre-Diffusion Cleaning Methods

RCA, Piranha and Megasonic cleans are commonly used in pre-diffusion clean, but each fabrication facility optimizes for its own sequence of semiconductor manufacturing processes. A production line may use one or several cleaning methods, and may have special requirements for production parameters such as size, temperature or timing.

Modutek designs and builds its own complete line of wet bench equipment and can advise customers on choosing the best processing stations for their applications. Ideal solutions often require extensive customization to optimize yield and reduce costs to a minimum. Modutek can provide custom solutions including pre-diffusion cleans, and can design new equipment for integration into the customer’s manufacturing line to meet specific wafer processing requirements.

Improving Piranha Etch Process Results in Silicon Wafer Cleaning

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Improving Piranha Etch Process Results in Silicon Wafer CleaningPiranha etch is a popular process for silicon wafer cleaning, but it has to be tightly controlled to be effective. The mixture of about one part hydrogen peroxide and three parts sulfuric acid rapidly removes organic matter from silicon wafers. The etch process takes place in heated quartz tanks where both temperature and chemical concentration affect the etch rate.

Precise control is difficult because mixing the original solution is exothermic, and the hot mixture is then maintained at between 130 and 180 degrees centigrade. The hydrogen peroxide decays to form water, diluting the mixture. The rate of decay depends on the temperature, but adding extra hydrogen peroxide to keep the concentration steady increases the temperature.

With several key variables interdependent, accurate control with traditional control systems is not easy and results can be varied. The mixture, with periodic addition or spiking with hydrogen peroxide, has a useful life of only about one day. Modutek has developed a control strategy that improves process results while reducing chemical use.

The Modutek “Bleed and Feed” Process Control Strategy Delivers Improved Results

Modutek’s “Bleed and Feed” process control strategy keeps the concentration of the Piranha mixture at the desired level while increasing the lifespan of the mixture. The company uses a two-tank “clean” and “dirty” tank design. When the concentration of hydrogen peroxide in the dirty tank goes down, a small amount of mixture is drained from the tank and is replaced by an equal amount from the clean tank. The clean tank then receives a fresh amount of mixture. The clean tank and dirty tank mixtures and the amounts of the bleed and the feed are all programmable so that the desired concentrations can be maintained for an extended period. Using the “Bleed and Feed” method, the Piranha mixture has a much longer life span.

“Bleed and Feed” Control Strategy Advantages

The control strategy of frequently adding small amounts of a programmable hydrogen peroxide/sulfuric acid mixture to the main “dirty” tank mixture to maintain its concentration provides several advantages to the silicon wafer cleaning process. Instead of spiking the mixture with hydrogen peroxide, the Modutek method adds an already mixed dosage to the main mixture, reducing temperature instability and allowing better control of the process. When the main mixture is relatively stable, it lasts longer and doesn’t have to be replaced as often. The temperatures and concentrations are more stable and the control of the etch or strip rate is more precise.

The Modutek “Bleed and Feed” Process Control Delivers Substantial Benefits

With more precise control of the process and a more stable Piranha mixture, Modutek’s “Bleed and Feed” process control improves Piranha etching results. Specific benefits include the following:

• Better control of the process increases reliability of strip results

• Precise temperature and concentration levels result in a constant strip rate

• Programmable dosage levels add control flexibility for predictable results

• Reproducing process parameters creates excellent repeatability

• Longer mixture life reduces chemical use

• Replacing the mixture less often reduces down time

• Chemical purchase and disposal costs are lower

• Risk of an accident from adding too much hydrogen peroxide is eliminated

Overall process results and wet etching performance are improved with the better outcomes and reduced costs of a Piranha etch process using Modutek’s “Bleed and Feed” process control. Customers incorporating Modutek’s new control strategy can expect reduced product failure rates, better output quality and overall improved wet process station performance.

Modutek continues to improve their silicon wafer cleaning equipment to provide customers with better process results using the “Bleed and Feed” process control in new wet bench stations. The company offers free consulting and can help customers choose an appropriate wet bench configuration or custom-build one to meet specific customer needs.

Why High Temperature Quartz Baths Are Required for Silicon Wafer Cleaning

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Silicon wafers undergo many process steps during the manufacture of semiconductor components and cleaning the wafers properly is an important factor in successful fabrication. Process steps include etching and diffusion, both of which involve coating the wafer with masking material to guide the etching chemicals or diffusion targets. Once a step is completed, the masking chemicals have to be completely removed. If traces remain or if other impurities are introduced, the quality of the final semiconductor product will be affected.

Silicon wafers are cleaned with aggressive chemicals to remove organic masking material and other possible contaminants. As a result, the cleaning solution container has to be able to resist the action of corrosive chemicals while remaining inert without becoming a source of contamination itself. Baths made of quartz are highly stable, resist corrosion and can be designed and built to avoid contamination. Quartz baths are an ideal solution to the challenges of silicon wafer cleaning and the maintaining of high levels of wafer cleanliness.

How Quartz Baths Clean Silicon Wafers

Quartz baths provide a clean and safe container for the chemical reactions that are used in silicon wafer cleaning. Depending on the materials used, the quartz bath may simply hold the wafers and the cleaning chemicals, but some processes require heating, circulating the solution or the addition of chemicals. In each case, the control actions must be accurate, reliable and easily duplicated.

For example, materials such as hydrochloric acid, sulfuric acid and hydrogen peroxide may be used for cleaning the silicon wafers. Quartz is impervious to these strong chemicals and the quartz tanks remain unaffected while the acids clean the silicon wafers. With SPM clean, sulfuric acid and hydrogen peroxide are mixed and maintained at a constant temperature of about 130 degrees centigrade. Periodic spiking with hydrogen peroxide is necessary because it decomposes in the solution. The mixture cleans wafers rapidly but can’t attack the quartz bath container.

Using bath containers that are inert and don’t contaminate is important because the electrical and physical structures making up modern semiconductor components are extremely sensitive to contaminating particles. As these structures become smaller and more tightly packed on a wafer, even a single particle can interfere with the etching or the diffusion process. Such interference from particles reduces the yield of semiconductor components and affects the productivity of the semiconductor manufacturing facility.

The Benefits of Using Modutek’s Quartz Baths

Modutek has over 30 years experience in quartz bath design and manufacture so that the company’s baths fulfill all the basic requirements for semiconductor processing and deliver additional benefits. Modutek can provide standard units where they satisfy customer requirements but can also design and build custom systems for special applications.

Modutek’s QFa series high temperature re-circulating quartz baths are safe and reliable with a low total cost of ownership. The semiconductor grade quartz of the baths is flame polished to reduce contamination and the vessels are designed for an especially long service life. Particle addition from re-circulating flow is kept to a minimum and remote control is available. Tank sizes range from an inner measurement of 7.75 x 7.75 inches and 9 inches high to 21.5 x 11.5 inches and 10.5 inches high. Custom sizes are available as well.

The QFa baths have an integrated heater that provides an operating range of 30 to 180 degrees centigrade. The heaters produce a temperature rise of 2 degrees per minute and control accuracy is plus/minus 1 degree centigrade, these variables depending on the operating conditions. The wide temperature range, fast thermal response and accurate temperature control make the Modutek quartz baths ideal for silicon wafer cleaning. The high precision guarantees excellent repeatability of the process between batches and the fast heating rate reduces process times. Overall, Modutek’s quartz baths can help improve the semiconductor production performance of manufacturing facilities and research labs. For a free quote or consultation on selecting the right equipment for your manufacturing process contact Modutek at 866-803-1533.

Reviewed and Approved by Douglas Wagner
President & CEO, Modutek Corporation

Improving Silicon Wafer Cleaning with the Piranha Etch Process

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The Piranha etch process removes organic material from silicon wafers rapidly and completely. Semiconductor manufacturing involves the repeated etching and cleaning of the silicon wafers and the Piranha mixture is a favorite method for the resist strip of wafers to prepare them for further processing. Modutek can provide high temperature re-circulating and constant temperature quartz baths and the company has developed a new “bleed and feed” control method to improve the silicon wafer cleaning process.

Modutek Quartz Baths for Piranha Etch

Modutek quartz baths are based on extensive experience and the use of the highest quality materials. The baths themselves are made of virgin boron-free fused quartz in a flame-retardant polypropylene housing. The QFa series is a high temperature re-circulating bath with a temperature range of 30 to 180 degrees centigrade while the Qa series is a constant temperature bath with the same temperature range.

Both bath series are temperature controlled to plus/minus 1 degree centigrade with a heat-up rate of 2 degrees centigrade per minute. Process control can be fully automated, semi-automatic or manual. The baths are available in a variety of sizes and Modutek will construct custom units as required. The units are ideal for Piranha etch applications because of their quick and even heating, accurate temperature control and extended vessel life.

Improving Piranha Process Control

The Piranha process uses an aggressive mixture of sulfuric acid and hydrogen peroxide to dissolve organic residue on the silicon wafers. The mixture is heated to about 130 degrees centigrade to improve the strip speed. Control of the cleaning is difficult because mixing sulfuric acid and hydrogen peroxide is exothermic and heats up the solution when the mixture is first prepared. As the mixture cools, it has to be heated to maintain its temperature and the strip rate.

The hydrogen peroxide in the mixture is unstable and decomposes to form water, diluting the mixture and slowing the strip rate. Heating the mixture increases the rate of decomposition of the hydrogen peroxide. To keep the concentration and the strip rate constant, the sulfuric acid and hydrogen peroxide mixture is periodically spiked with extra hydrogen peroxide. This addition keeps the strip rate elevated but the overall process is hard to control and the mixture has to be replaced completely about once per day. To improve the Piranha process and silicon wafer cleaning, the concentration and temperature variation issues have to be addressed.

The Modutek “Bleed and Feed” Process Control Method

Modutek has developed a method of improving control of the Piranha process by using a two tank system with a clean and a dirty tank. When the concentration of hydrogen peroxide goes down, a small amount of mixture from the dirty tank is drained and discarded. The drained amount is replaced from the clean tank. The stripping process can continue and the concentration is maintained at the desired level. The clean tank has its sulfuric acid and hydrogen peroxide replenished. All “feed and bleed” amounts are programmable to match specific process variables.

Benefits of the Process Change

The “bleed and feed” control method can be fully automated and the frequent addition of small amounts of sulfuric acid and hydrogen peroxide mixture keeps the strip rate constant and allows for continuous use of the mixture over an extended period of time. The benefits include:

  • Savings of chemicals can reach 75 percent while chemical purchase and disposal costs are correspondingly lower.
  • Process efficiency is increased due to less downtime for replacement of the chemicals.
  • Process results are improved due to a more constant strip rate.

As a leading semiconductor equipment manufacturer, Modutek provides customers with high quality equipment that offers the highest degree of process control. Modutek supports the new “bleed and feed” process change for Piranha strip in the company’s new wet bench stations. Call for a free consultation to discuss your specific process requirements.

Reviewed and Approved by Douglas Wagner
President & CEO, Modutek Corporation

Why Pre-Diffusion Cleans Are Important for Silicon Wafer Cleaning

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Why Pre-Diffusion Cleans Are Important for Silicon Wafer CleaningPre-diffusion cleans are carried out several times during the semiconductor manufacturing process, and each time the chemical residues and particles on the wafers have to be removed as completely as possible. If silicon wafers still have surface contamination when they are placed in the diffusion oven, diffusion may be uneven and the resulting semiconductor products may be defective.

The several methods available for wafer cleaning either use chemical baths or Megasonic cleaners to remove surface contaminants from the silicon wafers. Modutek offers a complete line of wet bench stations that support pre-diffusion wafer cleaning as well as other semiconductor fabrication processes.

The Importance of the Pre-Diffusion Wafer Cleaning Process

The contamination with particles on silicon wafer surfaces prior to diffusion is a key factor in reducing the yield of electronic components in semiconductor fabrication plants and research facilities. Particles may be diffused into the silicon and create electric defects or they may block diffusion behind the particle. After diffusion, particles may affect etching and interfere with microscopic conductors. The resulting electronic components may have to be scrapped.

As microscopic structures in silicon become smaller and more detailed, large particles become more disruptive on both an electrical and the physical scale. Even tiny particles that were previously considered unimportant can affect the smallest silicon structures. When electronic products are defective, it affects facility productivity and reduces throughput. Performance is lower and profitability is reduced. In some cases, the products are not defective but their life expectancy may be reduced and the manufacturer’s reputation is affected. An effective pre-diffusion wafer cleaning process results in fewer defects and a higher quality output.

How Pre-Diffusion Cleaning is Carried Out

Before being placed in the diffusion oven, silicon wafers are immersed in chemical or Megasonic baths. Surface impurities are dislodged, dissolved or chemically neutralized. Complete cleaning may take more than one process and the following methods are commonly used.

RCA cleaning is a popular method consisting of two components, SC1 and SC2, where the SC stands for standard clean. For SC1, the wafers are immersed in a solution of ammonium hydroxide and hydrogen peroxide. The aggressive chemicals remove all organic compounds from the wafer surfaces but may leave traces of metallic contamination. As a result, during SC2, the wafers are placed in a mixture of hydrochloric acid and hydrogen peroxide that removes any remaining metal ions.

An alternative to the RCA standard clean methods is the Piranha clean, especially useful for applications with heavy wafer contamination. It consists of a sulfuric and hydrogen peroxide mixture that rapidly removes material such as photo resist. A further feature of Piranha clean is the hydroxylation of the silicon wafer surface, making it hydrophilic or attractive to water, a characteristic useful for some subsequent process steps.

Megasonic cleaning uses high-frequency sound waves in a cleaning solution to dislodge contaminants from the surface of the silicon wafer. This cleaning method does not use harsh chemicals, and a generator is used to produce a signal in the MHz range at a specified power level. A transducer in the cleaning tank converts the signal to sound waves in water. The sound waves create microscopic cavitation bubbles with a strong scrubbing action that removes particles. Depending on the manufacturing process, semiconductor manufacturing facilities use one of these methods for pre-diffusion cleaning.

Modutek Pre-Diffusion Cleaning Equipment

Modutek’s wet bench chemical stations provide a complete range of pre-diffusion cleaning solutions. The company can offer equipment that supports each of the above cleaning methods as well as other semiconductor fabrication processes. All of Modutek’s pre-diffusion cleaning baths produce silicon wafers with extremely low particle counts while all of the company’s equipment is designed for high quality output, fast processing and efficient operation resulting in superior manufacturing facility performance. Contact Modutek for a free consultation or quote on equipment designed to meet specific manufacturing requirements.

Reviewed and Approved by Douglas Wagner
President & CEO, Modutek Corporation

 

How Customized Equipment Has Improved the Silicon Wafer Cleaning Process

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Different customized systems or custom components may improve silicon wafer cleaning processes because customers have special requirements or because the process characteristics are unusual. Suppliers taking on such projects must have extensive in-house experience and expertise together with a board line of silicon wafer cleaning equipment to provide custom solutions. When customization is required, effective solutions can improve throughput, lower costs, and result in higher output quality and yield. Modutek has both the experience and in-house expertise required to offer such customized equipment.

Customized Software

Modutek’s SolidWorks Simulation Professional and SolidWorks Flow Simulation software allows customers to calculate chemical doses accurately as well as track chemical usage. Such calculations are especially important for custom installations because the inputs and the values obtained may be non-standard. Modutek develops and writes all its own software so the company can make adjustments and implement software customization whenever it’s required by a customer. This means that customers can rely on software that corresponds to their customized systems rather than trying to operate a custom system with standard software. Modutek’s software can tailored to precisely control and monitor even the most customized installations.

Custom-Fit Equipment

A lot of the equipment that goes into a silicon wafer cleaning installation has to fit into an existing space or fit other limiting installation parameters. Such custom-fit equipment may include:

  • Megasonic systems
  • Teflon tanks
  • Quartz baths
  • or other custom equipment

Modutek can build custom versions of these components to fit any existing or new wet process system to optimize the silicon wafer cleaning process. Megasonic cleaning systems can be customized for frequency and power while tanks can be sized according to custom requirements and can be fitted with heaters or re-circulating pumps as required. In each case, Modutek can analyze the silicon wafer cleaning application and recommend the most appropriate solution.

Custom Wet Bench Station Design

When preparing a custom wet bench station design, Modutek first looks at the process specifications. The software, chemical delivery systems, baths and wafer handling must all fit together to satisfy the process requirements. Sometimes customized components can be used in a standard configuration but at other times specially designed components may be arranged in a custom system.

This approach provides end-user flexibility while respecting customer specifications and ensuring that the equipment performs as expected. All systems are designed and built at Modutek’s company facilities based on their own in-house expertise and experience.

Customized Wet Process Systems

Wet process systems can be customized at the component or system level, but they can also feature customized levels of automation. Standard systems are manual, semi-automatic or fully automatic but special solutions are always possible. Customers may want a manual system but also want certain process sub-steps to run automatically. A customer may want the handling of hazardous chemicals to be fully automated for safety reasons but want the rest of the process to be manual. On the other hand, a fully automatic system may have a requirement for operator intervention at a specific point. Because Modutek designs these systems in-house, such customization is seamless and problem-free.

Customized wet process systems can find application in many research and industrial fields. A customized system is often needed for prototype development and testing since the prototype can have unusual or unique features. Cutting-edge research and development in industry or at universities may also require the special characteristics available from customized systems. Even full production manufacturing facilities may need customization if they want to try special cost-cutting or quality-enhancing production methods. In each case Modutek can analyze the requirements and propose solutions.

With over 35 years of experience in wet process technology, Modutek has pioneered customization as a tool for improving silicon wafer cleaning processes and continues to develop unique customized solutions for its customers. If you need a customized solution for your application contact Modutek for a free consultation or quote.

Why Particle Removal is Essential in Silicon Wafer Cleaning

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During silicon wafer processing, impurities and particles are deposited on wafer surfaces or are left over from previous process steps. Such particles can cause defects in the final semiconductor product. With the reduced size of today’s silicon wafer microstructures, even the tiniest particles can block etching and affect the diffusion processes. The result appears in the final semiconductor circuit as either as a defect or reduce quality and life expectancy of the product. As a result, the focus of many wafer cleaning operations is to leave the silicon wafer surface intact but free of contaminating particles.

How Particles are Removed from Silicon Wafer Surfaces

The removal of particles can be difficult because they often have a chemical or electrostatic affinity for the silicon surface. They are attracted to the silicon wafer because of electrostatic charges and specific mechanisms have to be used to dislodge and remove them. The smaller the particle, the more such attraction may play a role and the harder it is to remove every particle from the wafer.

Mechanisms to remove particles include silicon wafer cleaning with a chemical that reacts with the particles, cleaning with a solution that dissolves the particles or washing the particles from the wafer surface. In each case, a specific type of equipment is required and traditional standard processes can be used together with new technologies aimed at removing even the smallest particles.

Cleaning Processes

Many chemical processes used to clean silicon wafers have remained unchanged since they were first used 30 years ago. These methods use aggressive chemicals to remove contamination from the wafers, which are then rinsed with de-ionized water and dried. These methods remove most of the contaminants but are less effective in removing the smallest particles. Refined older methods and new technologies such as megasonic cleaning are now often used to complete the cleaning process.

Cleaning methods used at different stages of the silicon wafer fabrication process include the following:

  • The RCA clean process, often carried out in two steps called SC1 and SC2, prepares a wafer for further processing. SC1 cleans wafers with a mixture of ammonium hydroxide and hydrogen peroxide to remove organic residue. SC2 uses hydrochloric acid and hydrogen peroxide to remove metallic residues and particles.
  • The Piranha cleaning process removes large amounts of organic residue such as photoresist. It uses sulfuric acid and hydrogen peroxide in a particularly corrosive mixture that acts quickly but must be handled with care.
  • Megasonic cleaning dislodges particles and other contaminants using microscopic cavitation bubbles generated by a megasonic cleaning system. The bubbles form and collapse in time with the MHz sound waves, delivering a scrubbing action that overcomes particle attraction to the silicon wafer surface.
  • The Ozone cleaning process uses ozone to convert organic particles and contaminants to carbon dioxide. All organic traces on a wafer surface are completely removed, leaving the silicon wafer free from particles.

One of the most critical processes for silicon wafer cleaning is the pre-diffusion clean process that takes place just before the wafers are placed in the diffusion oven. Any of the above methods or a combination of cleaning methods can be used to ensure that wafers are free of particles and the diffusion will be even and consistent.

Equipment Used for Wafer Cleaning

Modutek’s wet bench technology supports all the above cleaning methods and can be provided within their manual, semi-automated or fully automatic systems. The company can offer equipment for traditional cleaning and for the new megasonic and ozone methods as well. All cleaning equipment is available in standard configurations but Modutek can also design custom products to meet the needs of any of their customers’ silicon wafer cleaning requirements. If you need highly reliable equipment to support your semiconductor manufacturing processes call Modutek for a free consultation or quote at 866-803-1533 or email [email protected].

 

Modutek Named Among Top Suppliers in Global Semiconductor Wafer Cleaning System Market

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Modutek is a supplier of wet bench technology, wet processing and chemical handling stations to the semiconductor fabrication industry. The company was recently named as one of the top suppliers in the semiconductor wafer cleaning equipment market global opportunity Analysis and Industry Forecast (2017-2023) report published on alliedmarketresearch.com. Modutek emphasizes in house development of its software and equipment and focuses on a high level of customer support, leveraging the expertise of its own engineers to offer both standard and customized systems. At the forefront of innovative development, the company offers complete solutions to improve semiconductor fabrication facility performance and output quality.

The Characteristics of a Top Supplier

To become a top supplier in any industry a company has to supply high quality equipment that meets the needs of customers over an extended period of time. In the case of semiconductor equipment manufacturers, it means offering silicon wafer processing stations that execute the customer’s processes precisely with high output quality at a reasonable total cost of ownership. Top suppliers will know the details of the different etching, stripping and cleaning processes and will have developed equipment and software that handles them safely and effectively.

Modutek has been supplying the semiconductor equipment industry for over 35 years, building a reputation for high levels of competence and innovation. The company’s wet bench stations support all the common chemical processes for wafer fabrication and Modutek has developed innovative software and process steps that help reduce customer costs while increasing throughput and minimizing defective or low-quality semiconductor products. Modutek’s in house expertise resulting from designing, building and testing its own equipment allows the company to offer customized systems that exactly meet the needs of each customer. A high level of customer service completes the focus on customer satisfaction.

Innovation and Customer Focus

Modutek has become a top supplier to the global semiconductor wafer cleaning system market by introducing innovative solutions to address customer concerns in a changing technical and commercial environment. In general, the company introduces new systems that increase productivity while reducing costs. More specifically, new products allow for maintaining or even increasing yield in the face of challenges from denser component packing and more complex microstructures on the silicon wafer.

In an initiative to reduce wafer particle counts by eliminating particles added during the move from the last etch to the drying chamber, Modutek has introduced a single chamber process. Instead of exposing wafers to contamination during additional handling, the HF acid last etch and IPA drying are performed in the same chamber, eliminating a transfer step. In recent tests, Modutek has been able to demonstrate that the single chamber process is effective in achieving very low particle counts and higher quality outputs.

In addition to such specific innovations, Modutek has developed comprehensive automation solutions that help reduce error and waste. The fully automated Modutek wet process stations deliver accurate chemical dosages and precise process times to ensure exact execution of programmed process steps. Such automation is cost-effective and provides the tight process control required for the latest wafer fabrication tasks.

The Benefits of Choosing Modutek as a Supplier

In addition to the company’s lengthy experience as a semiconductor equipment manufacturer in a field that has a high turnover of suppliers, Modutek distinguishes itself through its in house expertise. All software and equipment design is carried out by Modutek engineers and all equipment is assembled and tested in house. As a result, Modutek can offer unparalleled service and support without having to call on third parties to help out. As a top supplier to its market, Modutek can propose the right solutions to particular customer’s requirements deliver the needed equipment from its extensive range and offer seamless support as needed.