The RCA clean process removes contaminants from the surface of silicon wafers so that additional wet process semiconductor manufacturing steps can take place. The process consists of two steps, with the SC1 step removing organic compounds and the SC2 step dislodging any remaining metallic residues or particles. Specialized wet benches ensure that contaminant and particle removal is as complete as possible and the silicon wafers remain clean. To accomplish this, the equipment carefully rinses away contaminants and minimizes the handling of the wafers. Automation can be used to replicate process parameters reliably and consistently. Modutek can supply both standard and customized specialized equipment to carry out the RCA clean process.
RCA Clean SC1 Removes Most of the Wafer Surface Contamination
The SC1 cleaning step uses chemicals to dissolve impurities while leaving the underlying silicon surface unaffected. The wafers are placed in a solution containing equal parts of NH4OH (ammonium hydroxide) and H2O2 (hydrogen peroxide) in five parts of de-ionized water. The solution is heated to about 75 degrees centigrade and the wafers are left in the solution for ten to fifteen minutes. Organic residues are dissolved and particles are removed. A thin layer of silicon oxide forms on the wafer and there is some contamination with metallic ions and particles.
RCA Clean SC2 Removes Metallic Impurities
For SC2, the newly cleaned wafers are placed in a bath containing equal parts of hydrochloric acid and hydrogen peroxide in five parts of de-ionized water. The exact ratio may vary depending on the application. The bath is heated to about 75 degrees centigrade with the wafers soaking for about ten minutes. The solution specifically eliminates alkali residues, metal hydroxides and other metallic particles. The wafers are now completely clean and free of all types of particles.
Wafer Cleaning Equipment Has to Fulfill Specialized Functions
Specialized equipment is needed to carry out RCA clean process steps effectively. The required chemicals have to be delivered in the right quantities to the cleaning baths and then, when the chemicals are no longer needed, they have to be neutralized and disposed of safely. The concentration of the chemicals, the bath temperature and the timing are all important for being able to subsequently reproduce the desired cleaning performance. Contaminants and particles have to be rinsed away and filtered out. Key features of effective cleaning are a low particle count on the wafer surface and a resulting low rejection rate for fabricated wafers.
Modutek’s Wet Process Equipment Provides Specialized Features
Modutek’s wet benches and chemical stations support both of the RCA cleaning steps. Chemical delivery systems ensure that the right amounts of chemicals are supplied to the process safely and that waste chemicals are neutralized before disposal. The FM4910 material of construction keeps particle contamination low and is safe to use with the acid and base processes of RCA clean. All baths include a continuous flow de-ionized water chamber with chemical circulation and filtration to rinse away and remove contaminants. The SolidWorks flow simulation software lets operators calibrate dosages precisely and store settings for future use.
As well as fulfilling customer needs from its extensive line of wet process equipment, Modutek can build custom systems for specific applications. Customers who wish to incorporate drying, etching or stripping functions as well as RCA clean in their process lines can rely on Modutek to design and build exactly what they need.
With 40 years of experience in the wet process and technology sector and one of the leading semiconductor equipment manufacturers, Modutek has the expertise in house to provide specialized equipment for the RCA clean process and other semiconductor manufacturing applications. Customers can count on Modutek to help them find effective solutions and supply the corresponding equipment. Contact Modutek for a free quote or consultation to discuss your process equipment requirements.