Single Wafer Wet Processing Equipment
Home / Wafer Processing Equipment / Single Wafer Wet Processing Equipment
Single wafer wet processing equipment is a semiconductor fabrication system that processes individual wafers through controlled chemical cleaning, etching, and surface preparation steps. Unlike batch processing systems that handle multiple wafers simultaneously, single wafer wet processing equipment delivers precise chemical application to one wafer at a time, enabling tighter process control, reduced chemical consumption, and higher uniformity across the wafer surface.
Modutek’s Single Wafer Wet Process System addresses the critical challenges faced across R&D laboratories and production facilities: achieving reproducible experimental results, maintaining consistent process control for reliable yields, and managing operational costs without compromising safety or performance. This configurable platform for single-wafer wet processing supports wafers up to 300mm and addresses contamination concerns through programmable, servo-controlled oscillating spray nozzles with precise nozzle-to-wafer distance control, delivering uniform cleaning and etching across the entire wafer surface.
High-accuracy rotation control, combined with programmable chemical flow-rate and pressure settings, eliminates process variability, enabling consistent results across multiple runs and substrate types. Whether optimizing novel etch chemistries or scaling proven processes to production volumes, the flexible chemistry delivery supports both single-pass operation and chemical recirculation using megasonic showerhead technology.
This system features the SECS/GEM option with a factory automation interface for seamless data exchange, comprehensive parameter logging for complete traceability, and ergonomic front-access loading that streamlines operator workflow. Safety features, including CO₂ fire suppression and dual containment design, protect personnel and equipment while reducing compliance costs.
The choice of 316L stainless steel or FM-4910 as the material of construction ensures chemical compatibility with your process requirements. A modular platform adapts to your throughput targets through customizable configurations for development, pilot, or high-volume production environments.
Benefits
- Precision Control - Programmable spray, rotation, and chemical delivery
- Flexible Materials - 316L stainless steel or FM-4910 construction options
- Factory Automation - SECS/GEM interface with data logging and lot tracking
- Enhanced Safety - CO₂ suppression and dual containment design
- Minimized Downtime - Ergonomic access and comprehensive service support
- Versatile Chemistry - Single-pass or recirculation with megasonic technology
- Cost-Effective - Reduced chemical consumption and modular design
- Full Traceability - Complete parameter logging for compliance
Features
-
Wafer Capacity - Up to 300mm, development to production scale
-
Construction - 316L stainless steel or FM-4910 with dual containment
-
Process Control - Servo spray nozzles with programmable parameters
-
Chemistry System - Megasonic shower head with adjustable flow
-
Automation - PLC touchscreen with SECS/GEM integration
-
Loading - Automated or manual front-access cassette handling
-
Safety - CO₂ suppression, nitrogen, and DI spray guns
- Throughput - Multiple spray chamber configurations available
Specifications
System Configuration
- Up to 300mm wafer capacity
- Development, pilot, and production configurations
- 316L stainless steel or FM-4910 materials
- Automated or manual loading
Process Control
- High-accuracy rotation control
- Servo-controlled oscillating spray nozzles
- Variable chemical flow and pressure
- Adjustable nozzle-to-wafer distance
- Megasonic shower head options
Automation
- PLC with color touchscreen
- SECS/GEM interface
- Parameter data logging
- PC-based lot tracking
Safety
- CO₂ fire suppression
- Dual containment design
- Rear access maintenance area
- Nitrogen and DI spray guns
Applications
RCA and Pre-Clean
- SC1 and SC2 cleaning
- Pre-diffusion cleaning
- Post-CMP cleaning
Etch and Conditioning
- Nitride etch
- HF, DHF, and BOE oxide etching
- KOH and TMAH silicon etching
- Surface preparation
Resist Strip
- Photoresist stripping
- Implant resist strip
- Post-etch resist strip
- Metal lift-off
Benefits
- Removes sub-micron particles down to 0.1 micron
- Gentle enough for delicate device features, unlike aggressive ultrasonic cavitation
- Direct MSD Series can be added to an existing tank for a quick upgrade
- Indirect MSI Series operates at temperatures up to 140°C
- Well-suited to SC1 and other particle-removal chemistries
- Built around proven Kaijo megasonic transducer technology
Features
- Indirect (MSI Series) bath design for 0.1 micron particle removal
- Direct (MSD Series) Teflon-coated transducer mounted in-tank
- MSI operation at temperatures up to 140°C
- MSD operation rated to 70°C maximum, ideal for SC1
- Kaijo megasonic technology, including the Quava megasonic generator
- Engineered for semiconductor, FPD, hard disk, solar, and crystal applications
- Designed, built, and tested in-house at Modutek's San Jose facility
Specifications
- Two configurations: Indirect MSI Series and Direct MSD Series
- MSI Series particle removal: 0.1 micron
- MSI Series temperature: up to 140°C
- MSD Series: Teflon-coated transducer plate located directly in the tank
- MSD Series temperature: 70°C maximum
- Compatible with SC1 cleaning chemistry
- Kaijo Quava megasonic cleaning system generator available
Applications
- RCA and SC1 Particle Removal
- Post-CMP Cleaning
- Pre-Diffusion and Pre-Deposition Cleaning
- FPD, Solar, Hard Disk, and Crystal Cleaning
Benefits
- Removes sub-micron particles down to 0.1 micron
- Gentle enough for delicate device features, unlike aggressive ultrasonic cavitation
- Direct MSD Series can be added to an existing tank for a quick upgrade
- Indirect MSI Series operates at temperatures up to 140°C
- Well-suited to SC1 and other particle-removal chemistries
- Built around proven Kaijo megasonic transducer technology
Features
- Indirect (MSI Series) bath design for 0.1 micron particle removal
- Direct (MSD Series) Teflon-coated transducer mounted in-tank
- MSI operation at temperatures up to 140°C
- MSD operation rated to 70°C maximum, ideal for SC1
- Kaijo megasonic technology, including the Quava megasonic generator
- Engineered for semiconductor, FPD, hard disk, solar, and crystal applications
- Designed, built, and tested in-house at Modutek's San Jose facility
Specifications
- Two configurations: Indirect MSI Series and Direct MSD Series
- MSI Series particle removal: 0.1 micron
- MSI Series temperature: up to 140°C
- MSD Series: Teflon-coated transducer plate located directly in the tank
- MSD Series temperature: 70°C maximum
- Compatible with SC1 cleaning chemistry
- Kaijo Quava megasonic cleaning system generator available
Applications
- RCA and SC1 Particle Removal
- Post-CMP Cleaning
- Pre-Diffusion and Pre-Deposition Cleaning
- FPD, Solar, Hard Disk, and Crystal Cleaning
FAQs about Single Wafer Wet Processing Equipment and Systems
The system is designed to process wafers up to 300mm in diameter. Modutek offers configurations optimized for development lab environments, pilot production lines, and high-volume manufacturing facilities. Each configuration can be customized based on your specific wafer size requirements and throughput targets.
Yes. The single-wafer wet cleaning equipment offers flexible loading options, including both automated wafer loading and manual loading with ergonomic front access. This flexibility allows R&D labs to prioritize experimental versatility, while production facilities can integrate full automation with SECS/GEM factory interface for lights-out operation and comprehensive lot tracking.
Modutek offers two primary materials of construction for single-wafer wet processing equipment: 316L stainless steel and FM-4910 material. Your selection depends on your specific chemistry set, cleanliness requirements, and compliance standards. The dual containment design for reservoirs, pumps, filters, and plumbing provides additional safety regardless of material selection. Our applications engineers can recommend the optimal material based on your process chemicals and long-term reliability goals.
The system features a programmable logic controller with local data logging of all process parameters, including chemical flow rates, pressure, rotation speed, and nozzle positioning. Lot tracking data is stored on the PC hard drive for full traceability. The SECS/GEM factory automation interface enables integration with fab-wide manufacturing execution systems. High-accuracy rotation control and precision nozzle-to-wafer distance management ensure consistent results across all wafers and lots.
The system is designed with a rear access maintenance area that simplifies service while maintaining safe working conditions. Nitrogen and DI water hand spray guns are included for routine cleanup. Modutek offers comprehensive service plans that include preventive maintenance, rapid-response support, and application engineering assistance. Our team works with your facilities staff to minimize downtime and maintain optimal system performance throughout the equipment lifecycle.
Resources
Get a Single Wafer Wet Processing System Built for Your Process
Modutek Corporation designs, builds, and tests every single wafer wet processing system in-house at its San Jose, California, facility, configuring each platform to your wafer size, chemistry set, and throughput targets across development, pilot, and high-volume production. Contact us to discuss your process goals, chemical requirements, and throughput targets for a customized single-wafer wet process system configuration, or to request a quote.