Solvents used in semiconductor manufacturing can remove oils and organic contaminants from silicon wafers in preparation for further processing steps. Acetone, isopropyl alcohol (IPA) and ethylene diproxitol (EDP) are solvents commonly used to clean wafers, remove photoresists, and in pattern transfers for the creation of microscopic structures on the wafer. The solvents are inflammable and require special safety measures to reduce the risk of fire and explosion, and they have to be disposed of safely. Stainless steel wet benches incorporating stainless steel processing tanks are an ideal solution for safe processing with solvents.

Safety Requirements for Stainless Steel Wet Bench Stations

The safe operation of stainless-steel solvent stations has to include the following safety features:

fire suppression
fire fighting
protection against exposure
protection against leaks
safe disposal

Fire is one of the principal safety hazards because solvents or their vapors can catch fire and explode. Fire suppression measures can include electrical design limiting the potential energy of sparks so they can’t ignite solvents and designing equipment to Class 1, Division 2 specifications.

Firefighting equipment has to be able to extinguish fires, should they occur. For inflammable liquids such as solvents, gas-type fire systems such as those using carbon dioxide are needed. It’s critical to have corresponding safety protocols and procedures to ensure workers are evacuated before triggering the extinguishing gases because the firefighting gas displaces oxygen and could cause suffocation.

Many solvents are harmful when workers are exposed to them over extended periods, either through direct contact or through breathing the vapors. A complete enclosure of the solvent processing tanks along with effective exhausts and leak detection limits the amount of solvent to which workers can be exposed.

Disposal of used solvents has to be carried out safely and according to environmental regulations. The disposal can be on-site if the facility has the corresponding capability, or the waste can be stored in a carboy for pick-up by a specialized disposal company.

Modutek Stainless Steel Wet Bench Stations are Safe and Customizable

Modutek stainless steel stations are made from 304 stainless steel and are available in fully automatic, semi-automatic, or manual versions. Dry to dry and fume hood designs are possible, and the stations feature casters and leg levelers. SolidWorks simulation software calculates the process flow characteristics and all design, assembly, and testing are carried out in-house. The stations can be built to the size and length required and extensive customization is available to exactly match customer requirements.

On the safety side, all stations are wired to the NFPA 70 & 79 standards and designed with fire suppression. Safety interlocks with emergency power off buttons are included. The station tanks have a one-inch lip exhaust and a continuous flow deionized water manifold. PVC safety shields are included and the stations have a nitrogen head case purge with Photohelic pressure interlocks. A Teflon nitrogen gun and deionized water hand spray are also included.

As a leading wet bench manufacturer, Modutek works closely with customers to determine how best to help them meet their objectives. Careful wet bench design can increase productivity and output while reducing costs. Modutek is focused on delivering wet bench equipment such as stainless-steel solvent stations using the best available materials and safe, high-quality designs.

With over 40 years of experience in the manufacture of wet benches and with the ability to carry out all design, assembly, and testing work in the company’s San Jose facility, Modutek is the ideal partner for semiconductor fabrication facilities and research labs. Modutek’s in-house experience allows for easy customization and safe execution of wet process semiconductor manufacturing projects of all kinds. Contact Modutek for a free consultation to discuss your specific solvent processing requirements.

Etching silicon wafers with potassium hydroxide (KOH) is a popular process for semiconductor manufacturing because it is relatively safe compared to other etching methods and because it features good control of the etch rate. When carried out in Teflon tanks, contamination is reduced and the etch rate can be controlled.

A key factor for successful etching is to determine the required etch rate. If the rate is too fast, the KOH may etch too far into the silicon, while if the rate is too slow, the etched holes might be too shallow. Improving the KOH etching process means applying several control methods to the etch rate to ensure the resulting etched shapes are exactly correct.

Process Factors that Affect the KOH Etch Rate

The KOH etch rate in silicon wafers is influenced by the following factors:

Process temperature. The higher the temperature of the KOH solution, the faster KOH will etch the silicon.
Solution concentration. A higher concentration increases the etch rate. Normally the concentration of the KOH solution is about 30 percent, but it can vary from 10 to 50 percent, with a corresponding effect on the etch rate.
Doping. Doping means adding impurities to the silicon crystal. When boron is placed into the silicon crystal lattice at a specific location, etching stops in that direction. Boron doping can influence the shapes to be etched in this way.
Crystal lattice orientation. The silicon crystal atoms are arranged in a cubic lattice that has a greater atom density in some directions than in others. Etching is slower in directions with a higher atom density.

All four factors have to be taken into account when designing the mask to obtain the microscopic structures in the silicon. The silicon wafer has to be oriented correctly to give the different etch rates along with the different lattice directions. Doping has to be in a place where etching is required to stop and the correct KOH solution concentration has to be mixed. These are initial conditions that are established before the process starts. A target temperature can be set as well but the temperature can be varied to adjust the etch rate during processing. The ability to vary the etch rate by changing the temperature results in excellent control of the KOH etching process.

Modutek Teflon Tanks Feature Rapid Heating and Precise Temperature Control

Modutek’s Teflon tanks for KOH processing are available in a circulating or a static design. The heat source is either inline or immersed in the overflow weir. An all-Teflon liquid path reduces the possibility of contamination. The heated tanks can improve the KOH etching process with short heat-up times and precise temperature control. As a result, Modutek Teflon tanks can keep the etch rate steady by maintaining an accurate temperature set point or can allow the etch rate to be adjusted with fast and reliable controlled temperature changes.

Both models of Teflon tanks feature uniform heating throughout the baths, level and temperature limit settings, and a drain interlock. Heat up rates are 2 to 3 degrees centigrade per minute and the temperature is controlled with a precision of plus/minus 0.5 degrees centigrade. The operating temperature is from 30 to 100 degrees centigrade and a cooling refluxor with Teflon cooling coils is included.

Modutek’s Teflon tanks are available in standard sizes but can work with customers to design and build systems with custom sizes and special requirements. With their high-quality materials, precise temperature controls, and customization capabilities, Modutek’s Teflon tanks can improve the KOH etching process to deliver better semiconductor manufacturing results. Contact Modutek for a free consultation to discuss your specific process requirements.

SEMICONDUCTOR WET PROCESS EQUIPMENT AND WET BENCH MANUFACTURER

Monthly Archives: September 2021

How Stainless-Steel Stations Provide Safe Solvent Processing

How Teflon Tanks Improve the KOH Etching Process