Choosing a Wafer Etching Process: Isotropic vs. Anisotropic
This article compares isotropic and anisotropic silicon wafer etching processes, highlighting key differences, process parameters, practical benefits, and equipment considerations to help semiconductor professionals optimize manufacturing results.
How Are Isotropic and Anisotropic Processes Used to Improve Silicon Wet Etching?
The microscopic structures produced by silicon wet etching can be created with a high degree of precision by using both isotropic and anisotropic processes. Isotropic etching is faster but may etch under masks to create rounded shapes. Anisotropic etching can be controlled more precisely and can produce straight sides with exact dimensions. In each case, […]