Semiconductor manufacturing and research facilities use wet bench technology to produce silicon wafers that require many cleaning and etching process steps. The wet bench equipment needs to be flexible and configured for the particular manufacturing process. Ideally equipment should be suitable for both acid and solvent applications with designs based on extensive experience using high quality materials and meeting or exceeding all applicable safety standards. Typical processes used for wafer processing equipment include KOH Etching, BOE (Buffered Oxide Etching), RCA Clean, plating and Megasonic cleaning. For special applications, custom designs to meet specific process requirements may be needed. Depending on the budget framework and the process, wet benches can be fully automated, semi-automated or designed for manual operation.
Fully Automated Stations
Wafer fabrication equipment with full automation offers excellent consistency of process steps and improved output quality. Precise control of chemicals and process times allows for minimization of waste and a reduction of operator errors. A reduced use of chemicals due to exact dosages can save money and effective neutralization of discharges means compliance with environmental regulations is easier. Software calculates the chemical dosages and each process is completely repeatable in a consistent process environment.
Semi-automated stations offer the robotics of the fully automated wafer processing equipment without the automation and at a lower cost. The servo-controlled robots with three degrees of freedom produce a uniform process and allow operators to precisely control chemical dosages and process times. Controls are user friendly via a touch screen and software for simulations and dosage calculations is available.
Stations without automation offer the same high quality process equipment as the automated stations but without the cost of automation. The manual wet benches include all the process and safety features of the automated equipment minus the cost of the robotics. The standard models and customized versions can be adapted for any wet bench processing application and the units are especially attractive due to the low cost of ownership.
Whether they are manual or automated, the process equipment features white polypropylene construction with wiring to NFPA 70 and 79. Safety features include an emergency power off button, safety interlocks and PVC safety shields. Process tanks have a one-inch lip exhaust and the units have a continuous flow DI water manifold along with a Teflon N2 gun and DI water hand spray. Third party certification for NEC and NFPA is available.
All of the wet benches and chemical stations can be ordered as standard units that can process semiconductor wafers up to 12” (300 mm) as well as glass substrates in a variety of sizes up to 30″ x 60″ solar panels. The units can be customized to fulfill any processing, etching or cleaning application. At Modutek, all design, assembly and testing is carried out in house including the writing of the SolidWorks Simulation software.
The Modutek fully automated, semi-automated and manual wet benches meet the highest standards of material quality and safety. All orders are reviewed by Modutek mechanical and electrical engineers and produced based on over 35 years of experience in the industry. The company uses its internal expertise to advise customers on the best equipment to meet their requirements.
Because Modutek writes its own software and builds the wafer processing equipment in house, the company can offer complete customer assistance without going to outside suppliers. Problems are handled internally and customers receive seamless technical support. Modutek’s technical staff can help customers during the ordering process, while manufacturing and assembly is taking place, during factory testing with de-ionized water and with on-site service after delivery. Call Modutek for a free quote and recommendations on using the right wafer processing equipment for your application.