Specialized Wafer Etching for Critical Wet Processing Applications

Improving the performance of critical wet process applications depends on selecting wet bench processes designed for the tasks at hand. Specialized equipment can support different etching and cleaning processes and can be used to make sure that the process selected can fulfill specific application requirements. Modutek’s wet process stations are specialized for the different processes but also guarantee safe and reliable operation.

Specific Tasks Require Specialized Processes

Depending on the etching or cleaning task to be carried out, specific wafer etching process characteristics are needed. The fabrication of solar cells has different requirements than the creation of microscopic structures for a processor. The major process characteristics that can impact wafer manufacturing include the following:

  • Low particle count
  • Etching speed
  • Selectivity
  • Precise control
  • Undercutting

Low particle counts are always desirable but can be critical for the smallest structures. A high particle count can result in high rates of rejection during final testing because the particles cause defects in tiny structures.

Etching speed is related to throughput. If the goal is to remove a substance as quickly as possible, high etching speed can be prioritized at the expense of other characteristics such as precision. Ideally the process speed is optimized so the process step doesn’t become a bottleneck.

For highly selective processes, the substrate material is not affected by the etchant while the material to be removed is etched rapidly. While selectivity is a basic characteristic of wet bench processing and is always important, some applications require especially high selectivity and the process has to be chosen accordingly.

Precise control becomes more and more critical as the dimensions of the micro-structures decrease and the packing of components becomes more dense. Since this tendency is a current trend in wafer manufacturing, control precision is becoming more important.

Undercutting compromises control precision but can be limited or eliminated with anisotropic etching by choosing the appropriate process and the orientation of the silicon crystal planes. When undercutting under the mask is not acceptable, anisotropic etching results in clean and sharp corners.

Choosing the right process to deliver the etching characteristics needed can have a high impact on wafer etching process line performance. Key performance indicators such as product rejection rates, throughput, down times and operating costs can vary greatly depending on the best match of process to application. An experienced equipment manufacturer can help customers choose the best solutions.

Modutek Provides Wet Process Solutions for Different Application Requirements

Modutek offers a complete line of wet process stations and can deliver solutions for general etching and cleaning as well as for specialized applications. Among the processes supported by Modutek equipment are the following:

  • Piranha etch
  • KOH process
  • Buffered Oxide Etch (BOE)
  • Ozone resist strip

Piranha etch cleans organic material from substrates and is often used to remove photoresist from silicon wafers. It cleans rapidly and does not etch the underlying silicon. Modutek can evaluate whether piranha etch is a good fit for an application.

KOH etching is characterized by good control and the possibility of use for anisotropic etching. The etch rate is controlled by changing the temperature of the KOH solution and Modutek offers baths with tight temperature control.

BOE is used primarily to etch silicon dioxide and silicon nitride. It features good control and does not undercut masks. Modutek supports BOE with its sub ambient filtered baths.

Ozone resist strip cleans organic residue while reducing the particle count. The powerful oxidizing action of the ozone combines with carbon in the organic compounds to leave wafers clean and free of particles. Modutek offers the ozone strip process as a chemical-free alternative to traditional strip methods.

With extensive experience in all areas of wet process wafer fabrication, Modutek can help choose the specialized process required for an application and deliver equipment of the highest quality. In supporting special applications as well as general etching and cleaning, Modutek ensures that it can meet all the wet process needs of its customers.

 

How Quartz Tanks Improve Wafer Manufacturing

The aggressive chemicals used in wet process wafer manufacturing have to be contained in process tanks that can resist etching and corrosion while remaining inert. Depending on the application, a process may require heating, filtration or the regular addition of chemicals. Quartz tanks from Modutek are made from semiconductor grade flame-polished quartz and are impervious to the acids and bases used in wafer processing. They minimize contamination of the wafers with particles and can be supplied in heated and re-circulating models. The high quality of the bath material along with advanced control strategies developed by Modutek help improve wafer manufacturing performance.

Cleaning Silicon Wafers Using Quartz Tanks

Wet bench processing of silicon wafers consists of fabrication steps such as etching and diffusion with cleaning required in between the steps. Wafers may be masked to etch specific parts of the wafer or to confine diffusion to certain target areas. After each process step is complete, the masking material has to be cleaned off.

Cleaning the wafers completely without contamination is critical because subsequent processing steps are affected if the wafer is not completely clean. With the microscopic architecture of semiconductor components becoming more tightly packed, even a single particle can result in a badly formed structure or conductor. When such malformations are incorporated into the final product, they can be the cause of defective or lower quality semiconductor components.

Specialized Process Controls Help Improve Wafer Manufacturing Results

Specialized quartz tanks from Modutek are based on over 30 years of experience and incorporate features to guarantee safe, reliable operation while delivering excellent wafer manufacturing results. Custom sizes, fast and even heating, reduced downtime and long vessel life help improve manufacturing facility performance and reduce costs. Quartz tank controls allow operators to program reproducible process environments and make sure temperatures and chemical concentrations are consistent. The three areas for which specialized control systems are useful are heating, chemical spiking and filtration.

Modutek high temperature re-circulating baths and constant temperature tanks heat up rapidly with a temperature rise of up to two degrees centigrade per minute. The operating temperature can range from 30 to 180 degrees centigrade and the temperature controller holds the temperature within plus or minus one degree centigrade. Quick heating helps improve throughput and accurate temperature control helps ensure high quality results.

For some chemical processes the concentration of chemicals can change during the process. Periodic spiking restores the chemical concentration to the desired level. Modutek has developed an innovative “bleed and feed” spiking method for the sulfuric acid and hydrogen peroxide (SPM) process.

The hydrogen peroxide of the SPM process decomposes and has to be replenished frequently. For traditional spiking, the mixture has an overall lifespan of only several hours. In Modutek’s clean tank/dirty tank using the “bleed and feed” spiking method, programmable amounts of mixture are drained from the dirty tank and transferred from the clean tank to the dirty tank. Programmable amounts of acid and peroxide are then added to the tanks. This method keeps the mixture fresh and increases the mixture’s lifespan to about one week.

In addition to controls for temperature and concentration, Modutek’s quartz tanks can reduce particle counts and wafer contamination. The quartz re-circulating tank can filter out particles down to 0.2 microns, improving output quality and reducing component failure rates.

Modutek’s quartz tanks are based on more than 30 years of experience and incorporate features to guarantee safe, reliable operation while delivering excellent wafer manufacturing results. Custom sizes, fast and even heating, reduced downtime and long vessel life help improve manufacturing facility performance and reduce costs.

Modutek continues to develop innovative techniques in the construction and use of quartz tanks for semiconductor manufacturing processing. The design of the quartz tanks and the associated advanced controls are a key factor in the production of semiconductor components of the highest quality. With extensive experience working with manufacturers in the development of advanced temperature, concentration and filtration controls, Modutek helps improve wafer manufacturing. Contact Modutek for a free consultation or quote on equipment designed to meet specialized manufacturing requirements.