Category Archives: Ozone Cleaning Process

How the Advanced Ozone Cleaning Process Improves Wafer Yields and Reduces Costs

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How the Advanced Ozone Cleaning Process Improves Wafer Yields and Reduces CostsEditor’s Note: This article was originally published in January 2017 and has been updated with additional information and reposted in April 2023.

Modutek’s advanced ozone cleaning is a highly effective method for removing contaminants from wafers. The process involves using ozone gas, which is a highly reactive oxidant, to break down and remove organic and inorganic contaminants from the surface of the wafer. The process is typically performed in a closed chamber that is designed to contain and recirculate the ozone gas.

How Advanced Ozone Cleaning Works

The advanced ozone-cleaning process works by exposing the wafers to a controlled amount of ozone gas. The gas is generated on-site using an ozone generator and is then injected into the cleaning chamber. The wafer is then exposed to the ozone gas for a specific amount of time, which can range from a few seconds to several minutes, depending on the type and level of contamination.

During the exposure time, the ozone gas breaks down and oxidizes the organic and inorganic contaminants on the wafer surface, converting them into carbon dioxide, water, and other harmless byproducts. The byproducts are then removed from the chamber through a ventilation system, leaving the wafer surface clean and free of contaminants.

The advanced ozone-cleaning process is highly effective at removing a wide range of contaminants, including organic and inorganic compounds, particles, and metals. Additionally, the process is environmentally friendly and does not generate any hazardous waste or byproducts. Overall, advanced ozone cleaning is a safe and effective method for removing contaminants from wafers, resulting in improved yields, reduced costs, and increased productivity.

Advantages and Benefits of Advanced Ozone Cleaning

Advanced ozone cleaning is a highly effective method for removing contaminants from wafers, which can significantly improve wafer yields and reduce manufacturing costs. Unlike traditional cleaning methods, such as wet cleaning and plasma cleaning, advanced ozone cleaning uses ozone gas to break down and remove organic and inorganic contaminants from wafers. In this article, we will discuss the benefits and advantages of using advanced ozone cleaning in the semiconductor manufacturing process.

Improved Cleaning Performance

One of the main advantages of using advanced ozone cleaning is its superior cleaning performance. Ozone gas is a highly reactive oxidant that can effectively remove a wide range of contaminants, including organic and inorganic compounds, particles, and metals. Compared to traditional cleaning methods, advanced ozone cleaning can achieve much higher levels of cleanliness, which can lead to improved wafer yields and reduced defect rates.

Reduced Chemical Usage

Another benefit of using advanced ozone cleaning is its reduced chemical consumption. Traditional cleaning methods often require large quantities of chemicals, which can be expensive and potentially hazardous. In contrast, advanced ozone cleaning uses only a small amount of ozone gas, which is generated on-site and does not require the storage or handling of hazardous chemicals. This can result in significant cost savings and reduced environmental impact.

Better Process Control

Advanced ozone cleaning also offers improved process control compared to traditional cleaning methods. By precisely controlling the amount and duration of ozone exposure, the cleaning process can be optimized for each specific application. This can result in improved process repeatability, reduced variability, and higher product quality.

Reduced Downtime

Using advanced ozone cleaning can also lead to reduced downtime and increased productivity. Traditional cleaning methods often require longer cleaning cycles and can result in extended equipment downtime. In contrast, advanced ozone cleaning can be performed quickly and efficiently, reducing the amount of time equipment needs to be offline. This can result in increased equipment utilization and improved manufacturing throughput.

Lower Cost of Ownership

Finally, advanced ozone cleaning can result in a reduced cost of ownership for semiconductor manufacturers. By improving wafer yields and reducing defect rates, advanced ozone cleaning can lead to increased revenue and reduced waste. Additionally, the reduced chemical consumption, improved process control, and reduced downtime can result in lower operating costs and increased profitability.

The Bottom Line

Advanced ozone cleaning is a highly effective method for removing contaminants from wafers, which can significantly improve wafer yields and reduce manufacturing costs. With its superior cleaning performance, reduced chemical consumption, improved process control, reduced downtime, and reduced cost of ownership, advanced ozone cleaning is an ideal choice for semiconductor manufacturers looking to improve their manufacturing processes.

Modutek Provides Solutions for Manufacturers

Modutek offers equipment for applying the ozone-cleaning process to semiconductor manufacturing and can help determine the ideal configuration for a particular application. The company also delivers equipment for traditional chemical bath cleaning methods and is therefore ideally placed to advise how the new ozone cleaning methods can improve production. Semiconductor manufacturers can take advantage of this capability to cut costs and increase productivity at their facility. Contact Modutek for a free consultation to discuss your specific process requirements.

How Advanced Ozone Cleaning Reduces Costs and Improves Wafer Yields

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How Advanced Ozone Cleaning Reduces Costs and Improves Wafer YieldsWhen ozone is used to clean silicon wafers, it reduces the use of aggressive chemicals and it can decrease the wafer particle count. Modutek’s advanced ozone cleaning process can clean more quickly than many chemical-based processes and it delivers other benefits. Ozone is used to remove organic contaminants from wafer surfaces in either the Coldstrip sub ambient process or the Organostrip process. Either process can reduce overall wafer fabrication costs and improve manufacturing facility performance.

Advanced Ozone Cleaning Outperforms Chemical Stripping

With increased regulation of the use of dangerous chemicals and pressure on businesses to make their operations more environmentally friendly, Modutek developed the advanced ozone cleaning processes to help semiconductor manufacturers and research labs reduce chemical use. Ozone is introduced in Modutek’s DryZone system in compact units using the Coldstrip or Organo strip processes. Both cleaning methods also feature a reduced particle count compared to chemical cleaning methods.

In the Coldstrip process, wafers are first rinsed with deionized water to remove soluble non-organic contaminants. The process operates at four to ten degrees centigrade. After the rinsing, ozone is introduced into the chamber and combines with the carbon of the organic compounds on the wafer surfaces. The ozone-carbon reaction forms carbon dioxide, leaving wafers clean and almost free of particles.

The Organostrip process also uses ozone but operates at ambient temperature. Ozone is introduced into the process dissolved in acetic acid, a mild solvent in which ozone has a very high solubility. The wafers are rinsed with the ozone-acetic acid solution and the high level of ozone rapidly oxidizes the organic contaminants. The waste products of the process do not require special treatment. Both processes work quickly and feature excellent cleaning performance with low particle counts.

Changing to the Advanced Ozone Cleaning Process Delivers Substantial Benefits

The major benefits of changing from chemical cleaning to an advanced ozone cleaning process is a reduction in the use of toxic chemicals and improved cleaning performance with a lower particle count. These two factors are at the root of additional benefits resulting in cost savings, better yields and improved safety for employees.

Reduced Use of Chemicals

When the use of toxic chemicals is reduced, there are cost reductions in addition to savings resulting from fewer chemical purchases. Other savings include reduced costs for chemical storage, handling and disposal. Employees benefit from lower exposure to harmful chemicals and from increased workplace safety because there is less danger of spills or accidents.

Regulatory compliance costs are also reduced. As environmental regulations become more onerous, costs rise and compliance becomes more difficult. Reduced chemical use results in lower compliance costs, and a more environmentally friendly operation helps improve community relations and the environmental reputation of the business.

Lower Particle Contamination

Lower particle counts are the result of better cleaning performance. Particle counts play ang increasingly important role in wafer structures that are smaller and more tightly packed. Even a single particle can block a conducting path or the etching of a tiny detail. Fewer particles means a lower rate of defective products and higher yields. Product quality and longevity may also be improved.

Improved Cleaning Performance and Wafer Yields with Less Equipment

In addition to a lower particle count, the improved cleaning performance of the advanced ozone cleaning process results in shorter cleaning times within a smaller footprint. Modutek’s DryZone units used for the ozone cleaning process are compact and take up less space than the corresponding chemical cleaning stations. Cleaning is more rapid resulting in higher throughput. As a result of these benefits, the overall performance of the silicon wafer fabrication facility can improve substantially.

Modutek Provides Advanced Equipment for Manufacturers

As one of the leading semiconductor equipment manufacturers, Modutek can advise customers on how to implement a change to ozone cleaning. Modutek offers a free consultation and quote on their equipment, and ensures their equipment will support processes that meet customer requirements.

How Advanced Ozone Cleaning Reduces Chemical and Solvent Usage

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As environmental concerns mount and regulatory compliance becomes more difficult, companies that reduce the use of hazardous chemicals and solvents will have a competitive advantage. In addition to reducing costs, the use of fewer corrosive chemicals improves workplace safety and can lead to better semiconductor manufacturing facility performance. Modutek’s patented advanced ozone cleaning process saves money and reduces the contaminating particle count on wafer surfaces. Depending on process requirements, ozone cleaning can out-perform traditional wafer cleaning with harsh chemicals. Modutek’s ozone cleaning process is compact, fast, and safe.

Advanced Ozone Cleaning Converts Organic Impurities to Carbon Dioxide

Modutek has developed the Cold Strip sub ambient process that operates with deionized water and the Organostrip process that uses a mild acid at room temperature for photo resist strip. This also eliminates the use of NMP solvent base strippers. Both use ozone to clean organic contaminants from wafer surfaces and both leave harmless residues that allow for disposal without special neutralizing procedures.

The Cold Strip Advanced Ozone Cleaning Process operates at four to ten degrees centigrade and uses deionized water to strip silicon wafers of water-soluble inorganic impurities. After the wafers are rinsed with deionized water, ozone is introduced into the chamber. The ozone reacts with the remaining organic impurities and converts them to carbon dioxide. Particle contamination is reduced as well because the ozone reacts with organic particles. Wafers are more effectively cleaned with a reduced particle count.

In the Organostrip process, wafers are rinsed with a solution of a mild acid and ozone at room temperature. The acid has a high ozone solubility that lets the ozonated solution remove organic compounds from the wafer surfaces quickly and completely. The process is compatible with metals such as gold, copper, and aluminum, and the waste products of the Organostrip process are not hazardous.

Modutek uses its DryZone solvent gradient dryer for the Advanced Ozone Cleaning Process that the company developed to address customer concerns. Customers experienced high particle counts and issues with the use of hazardous chemicals, including their effect on the environment. The developed process successfully addresses these issues and delivers effective wafer cleaning.

Modutek’s Advanced Ozone Cleaning Process Provides Substantial Benefits

Modutek developed the Advanced Ozone Cleaning Process to address specific customer concerns, but the Cold Strip and Organostrip processes also improve wafer cleaning and facility operations. The benefits of using ozone cleaning include the following:

  • Reduced cost for process chemicals. The acids used in a traditional wafer cleaning process, such as sulfuric or hydrochloric acids, are expensive, and the cleaning processes such as Piranha clean use substantial volumes of chemicals. Ozone and the mild acids or solvents used in ozone clean are less expensive and the solutions last longer.
  • Reduced cost for chemical handling. The storage, delivery, and disposal of hazardous chemicals used for traditional wafer cleaning is expensive. The handling of ozone and the mild chemicals used for ozone cleaning requires no special measures.
  • Improved workplace safety. The chemical baths used for traditional wafer cleaning often operate at high temperatures and they can be dangerous. The ozone cleaning process chemicals are safe and the operation is done at sub ambient or at room temperature.
  • Higher throughput. Advanced ozone cleaning takes less time than traditional cleaning methods.
  • Improved yields. Ozone cleaning reduces particle counts and results in higher output quality with fewer product defects.

Modutek’s Continued Process Improvement Delivers Innovative Solutions for Customers

Modutek works closely with customers to identify new concerns and solve existing processing problems. Using extensive in-house experience and expertise in wet process technology allows Modutek to provide innovative solutions to meet customer needs. New wet process steps such as Advanced Ozone Cleaning can help customers improve semiconductor manufacturing facility performance and increase profitability.

Using the Advanced Ozone Cleaning Process to Improve Wafer Yields

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Using the Advanced Ozone Cleaning Process to Improve Wafer YieldsTwo key goals for semiconductor manufacturers are to increase process yields and to reduce chemical usage. Wet process semiconductor manufacturing is sensitive to wafer contamination by microscopic particles that increase final product rejection rates and reduce output quality. The ozone cleaning process can reduce particle counts and improve wafer yields by reducing the number of defective products. At the same time, cleaning organic contaminants from the wafer with ozone reduces the use of expensive and toxic chemicals. Modutek’s Advanced Ozone Cleaning Process allows semiconductor manufacturing facilities to increase throughput and output quality while reducing operating costs.

How Advanced Ozone Cleaning Improves Wet Process Line Performance

Modutek’s Advanced Ozone Cleaning Process uses ozone to remove organic contaminants from the surfaces of silicon wafers during wet bench processing. Ozone is used with either room temperature acidic acid or chilled DI water to clean wafers without aggressive chemicals. In addition to saving money due to reduced use of chemicals, ozone cleaning takes less space and is faster than many chemical-based wet bench processes.

Ozone cleaning takes place in Modutek’s DryZone System. Modutek has developed the Coldstrip sub ambient process and the Organostrip process that operates at room temperature. Both ozone cleaning processes deliver reduced particle counts and increased yields.

The Coldstrip process operates at four to ten degrees centigrade and introduces ozone into the ozone chamber after the wafers have been rinsed with de-ionized water. The rinsing removes non-organic contamination while the ozone combines with the carbon of the organic contaminants to produce carbon dioxide. After completion of the Coldstrip process, the wafers are clean and almost particle-free.

In the Organostrip process, the wafers are rinsed with acidic acid containing ozone. The acidic acid used has extremely high ozone solubility and the high ozone level producing produces rapid decomposition and oxidation. The ambient temperature process eliminates the use of toxic chemicals and the process waste products are harmless.

The Modutek Advanced Ozone Cleaning Process Improves Performance While Saving Money

Modutek developed the Advanced Ozone Cleaning Process to achieve low particle counts and to reduce the use of harmful chemicals. Reduced particle counts are needed for the more compact architecture of modern semiconductors where a single particle can cause defects or lower component quality. Reduced use of chemicals is mandated by increasingly strict environmental regulations while chemical purchase, storage and disposal costs continue to rise. The patented Modutek Advanced Ozone Cleaning Process successfully addresses these issues.

Specific benefits from using the ozone cleaning process include the following:

  • Better wafer yields due to lower particle count
  • Savings from reduced use of chemicals
  • Compatibility with metal films
  • Safer work environment due to absence of toxic substances
  • More environmentally friendly operations
  • Space saving due to more compact equipment
  • No toxic waste disposal issues

Modutek’s Advanced Ozone Cleaning Process increases throughput due to shorter cleaning times and higher yields while cost savings due to reduced use of chemicals are substantial. Semiconductor manufacturers can improve the overall performance of their facility by incorporating Modutek’s DryZone cleaning stations in their wet process lines.

Modutek Can Help Customers with Innovative Solutions

The Advanced Ozone Cleaning Process is one example of Modutek’s initiatives to improve the performance of wet process technology stations and help customers address common problems. The patented process solves issues with current semiconductor manufacturing and helps customers with product quality and with their bottom line.

With Modutek’s emphasis on customer service and on working with customers to improve wet process technology, the company continues to be a leader among semiconductor equipment manufacturers. Customers can rely on Modutek to supply the equipment they need and to provide the support ensuring the equipment meets or exceeds performance expectations.

Why Particle Removal is Essential in Silicon Wafer Cleaning

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During silicon wafer processing, impurities and particles are deposited on wafer surfaces or are left over from previous process steps. Such particles can cause defects in the final semiconductor product. With the reduced size of today’s silicon wafer microstructures, even the tiniest particles can block etching and affect the diffusion processes. The result appears in the final semiconductor circuit as either as a defect or reduce quality and life expectancy of the product. As a result, the focus of many wafer cleaning operations is to leave the silicon wafer surface intact but free of contaminating particles.

How Particles are Removed from Silicon Wafer Surfaces

The removal of particles can be difficult because they often have a chemical or electrostatic affinity for the silicon surface. They are attracted to the silicon wafer because of electrostatic charges and specific mechanisms have to be used to dislodge and remove them. The smaller the particle, the more such attraction may play a role and the harder it is to remove every particle from the wafer.

Mechanisms to remove particles include silicon wafer cleaning with a chemical that reacts with the particles, cleaning with a solution that dissolves the particles or washing the particles from the wafer surface. In each case, a specific type of equipment is required and traditional standard processes can be used together with new technologies aimed at removing even the smallest particles.

Cleaning Processes

Many chemical processes used to clean silicon wafers have remained unchanged since they were first used 30 years ago. These methods use aggressive chemicals to remove contamination from the wafers, which are then rinsed with de-ionized water and dried. These methods remove most of the contaminants but are less effective in removing the smallest particles. Refined older methods and new technologies such as megasonic cleaning are now often used to complete the cleaning process.

Cleaning methods used at different stages of the silicon wafer fabrication process include the following:

  • The RCA clean process, often carried out in two steps called SC1 and SC2, prepares a wafer for further processing. SC1 cleans wafers with a mixture of ammonium hydroxide and hydrogen peroxide to remove organic residue. SC2 uses hydrochloric acid and hydrogen peroxide to remove metallic residues and particles.
  • The Piranha cleaning process removes large amounts of organic residue such as photoresist. It uses sulfuric acid and hydrogen peroxide in a particularly corrosive mixture that acts quickly but must be handled with care.
  • Megasonic cleaning dislodges particles and other contaminants using microscopic cavitation bubbles generated by a megasonic cleaning system. The bubbles form and collapse in time with the MHz sound waves, delivering a scrubbing action that overcomes particle attraction to the silicon wafer surface.
  • The Ozone cleaning process uses ozone to convert organic particles and contaminants to carbon dioxide. All organic traces on a wafer surface are completely removed, leaving the silicon wafer free from particles.

One of the most critical processes for silicon wafer cleaning is the pre-diffusion clean process that takes place just before the wafers are placed in the diffusion oven. Any of the above methods or a combination of cleaning methods can be used to ensure that wafers are free of particles and the diffusion will be even and consistent.

Equipment Used for Wafer Cleaning

Modutek’s wet bench technology supports all the above cleaning methods and can be provided within their manual, semi-automated or fully automatic systems. The company can offer equipment for traditional cleaning and for the new megasonic and ozone methods as well. All cleaning equipment is available in standard configurations but Modutek can also design custom products to meet the needs of any of their customers’ silicon wafer cleaning requirements. If you need highly reliable equipment to support your semiconductor manufacturing processes call Modutek for a free consultation or quote at 866-803-1533 or email [email protected].

 

How the Ozone Cleaning Process Improves Silicon Manufacturing Yields

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How the Ozone Cleaning Process Improves Silicon Manufacturing YieldsA process that uses ozone with water or with a mild acid can clean, strip and etch wafers more rapidly and at lower cost than traditional processes. Modutek’s proprietary Advanced Ozone Cleaning Process eliminates the use of expensive chemicals while improving process performance and reducing environmentally harmful waste.

Modutek provides custom designed equipment to meet the specific requirements of customers and offers an ozone cleaning process as a solution for better silicon wafer manufacturing yields. The patented technology can replace traditional methods that use expensive chemicals and high temperatures with a room-temperature process that is environmentally friendly.

How the Ozone Cleaning Process Works

Modutek’s ozone cleaning process provides cleaner silicon wafers with reduced particle counts. For example, in Modutek’s DryZone solvent gradient dryer, the patented process rinses substrates with deionized water to remove water-miscible inorganic impurities and then exposes them to ozone in an ozone chamber. All traces of organic materials are converted to carbon dioxide. The resulting substrate surfaces are free from particles, moisture and trace organic materials and are stable hydrophilic surfaces.

For silicon wafers, the surfaces are Si-O terminated. If hydrophobic, Si-H terminated surfaces are required, a ten second post-ozone process can complete a conversion. Because the dryer uses reactive chemistries, it is particle-reducing rather than just particle-neutral.

In Modutek’s Organostrip process, wafers are exposed to an ozonated organic solvent at room temperature. The company’s technology produces very high ozone solubility in the liquid. The process results in a fast resist removal and it is compatible with all metals tested, including aluminum, copper, gold, tantalum, titanium and tungsten.

In all the Modutek ozone cleaning processes, the exact chemistry is delivered to the point of use in compact equipment that requires fewer steps and a smaller number of tanks than conventional wet benches. In contrast to traditional solvent processes, the ozone process solution has a longer useful lifespan and results in a more benign discharge. Available ozone processes include resist removal, surface preparation and final clean.

Advantages Compared to the Piranha Process

A commonly used conventional acid process is the sulfuric acid and hydrogen peroxide based Piranha process. Key advantages of the ozone cleaning process over the Piranha process include:

  • More rapid processing: Batches of 100 wafers and a rate of 6 batches per hour per process tank allow silicon manufacturing facilities to achieve a higher throughput.
  • Better compatibility: The Piranha process is not compatible with most metals while the Modutek ozone cleaning process has broad compatibility.
  • Fewer particles: The number of particles left on wafers processed with the Modutek ozone cleaning systems is extremely low while Piranha leaves particles on the surfaces.
  • Better safety: The Piranha process operates with highly corrosive chemicals heated to 130 degrees C. The Modutek ozone cleaning systems work at room temperature without harsh chemicals.
  • Lower equipment cost: With fewer tanks and process steps, the Modutek ozone cleaning systems can cost substantially less than a Piranha installation
  • Lower operating costs: Piranha process chemicals are up to twice as expensive as Modutek ozone cleaning chemicals. The total cost of ownership of a Piranha installation is much more than that of an ozone station.

Modutek can evaluate the needs of a silicon manufacturing facility and offer appropriate solutions. The new ozone technology increases manufacturing yields by reducing contaminants and can reduce overall costs. If you want a free consultation or quote on using Modutek’s ozone cleaning process to improve your manufacturing yields, call 866-803-1533 or email [email protected].

Modutek At Semicon Conference in China

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Modutek At Semicon Conference in ChinaModutek, a leading provider of leading-edge wet benches and wet process equipment, will have a factory representative at the Semicon Conference in Shanghai China from March 15-17, 2016. Modutek will be with their China Rep Laserwort located in Hall N3 at booth 3401. Information about the Semicon Conference can be referenced at http://www.semiconchina.org/ and details on Modutek’s attendance at the conference can be referenced at: Modutek at Semicon Conference in China

Stop by the Modutek /Laserwort booth to get information and answer any questions you have about Automated, Semi-Automated and Manual Wet Process Stations used for acid/base, solvent and ozone cleaning or photo resist strip. Modutek also provides IPA vapor drying and Megasonic cleaning equipment to support your manufacturing applications. In addition environmentally friendly acid neutralization systems and air scrubbers are available with all their equipment.

Additional details on some of Modutek’s products are listed below:

  • Fully-automated Wet Bench Equipment
    • Benefits include:
      • Full automation control with touch screen
      • SolidWorks Simulation Professional software
      • SolidWorks Flow Simulation software
      • Servo motor automation
      • All robotics and software designed in house
      • Complete design, assembly and test done according to your specifications
  • Semi-automated Wet Bench Equipment:
    • Benefits include:
      • Automation control with touch screen
      • SolidWorks Simulation Professional software
      • SolidWorks Flow Simulation software
      • Servo motor automation
      • All robotics and software designed in house
      • Complete design, assembly and test done according to your specifications
  • Manual Wet Bench Equipment:
    • Benefits include:
      • High end manual equipment at competitive pricing
      • Meets or exceeds all current safety standards
      • Designed to meet any process requirements
      • Can accommodate custom designs and processes
      • Low cost of ownership
      • Equipment designed for future expansion

Our fully-automated, semi-automated and manual wet bench equipment supports the following applications:

  • KOH Etching
  • Quartz cleaning
  • Ozone Etching
  • Ozone Cleaning
  • SC1 & SC2 featuring Megasonic Cleaning
  • BOE (Buffered Oxide Etching)
  • MEMs processing
  • Plating
  • All solvent applications
  • Hot phosphoric (Nitride Etching)
  • SPM Cleaning
  • Precision Part Cleaning
  • IPA Vapor Dryer
    • Benefits include:
      • Very low IPA consumption
      • No moving parts inside drying chamber which eliminates wafer breakage
      • Most drying cycles completed within 10-15 minutes
      • No watermarks
      • Drying technology can be easily designed into your wet bench eliminating one transfer step
    • The IPA Vapor Dryer supports the following applications:
      • Ozone Cleaning
      • Wafer Drying

Modutek has over 35 years of experience developing and building wet bench stations and wet process equipment that provides highly reliable results for precision processes. They also provide world-class service, and customer support. Call 866-803-1533 or email [email protected] for a free quote or consultation to discuss your requirements.

How the Ozone Cleaning Process Supports Green Technology

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How the Ozone Cleaning Process Supports Green TechnologyAs many people become more environmentally conscious, it is important to understand the manufacturing process behind semiconductors. The majority of companies use chemical solvents during the process, which requires special handling and is not environmentally friendly. In contrast Modutek provides equipment that uses a method that is not only more cost effective but is also environmentally friendly. This method is the Ozone cleaning (stripping) process.

There are three distinct advantages to the Ozone cleaning process:

  • Is cleaner than using a chemical cleaning processes.
  • Is more cost effective.
  • Is safer.

How the Ozone Cleaning Process Works

Most semiconductor manufacturers use chemicals in their process. While these chemicals serve their purpose, it also means that the solvents introduce another element to the process that makes it both more complex and less environmentally friendly. The chemicals must be processed in a way so that they are disposed of properly according to environmental regulations.

Modutek designed the ozone cleaning (stripping) process to both reduce the contamination inherent with the process as well as the cost. Without using chemicals, there is considerably less to cleanup during the manufacturing process. The equipment is specifically designed to reduce or eliminate the need for solvents.

One of the reasons it is more efficient and cleaner than the chemical process is that it works at ambient (room temperature) or below. By eliminating the need for chemicals like solvent base strippers or sulfuric acid and hydrogen peroxide, the Ozone cleaning process or stripping process gets the same results without needing to change the temperature of the components.

Of course, every company has its own process, and some of them require the use of at least a few solvents. In these cases, Modutek’s equipment can eliminate the use of solvents required.

Why It’s Safer

The more chemicals a process requires, the more solvent there is at the end, and the more potentially hazardous that solvent is. They must be contained and properly handled based on environmental regulations, and special training is required for those who have to handle it. There is an increased risk of spills and other risks as well.

Also, the more chemicals a company uses, the more exposure employees and customers have to those chemicals because they cannot be completely removed from the final product. There are inherent risks with any chemical a person is exposed to, no matter how small. The Ozone cleaning process (stripping process) completely eliminates the use solvents.

It’s Cost Effective

One of the biggest benefits of the process is that it is considerably more cost effective than the traditional methods. Companies do not need to invest in nearly as many chemicals to complete the process, which also means that the process will not be delayed if the supplies do not arrive when they are expected. That also means less inventory cost.

At the other end of the process, there is less to cleanup once the process is complete. Special containers for handling the solvents will not be required, and there is less hazardous waste that would need to be disposed.

While the process does require its own training, it does not have nearly as many safety risks that will require mandatory annual training to ensure safety guidelines are followed. With less personal protective gear, the Ozone cleaning process is simply more cost effective in nearly every way.

Conclusion

Traditional cleaning processes require chemical solvents, which increases the risks and the costs. It takes longer to process and dispose the required solvents, and the final product is not as clean as a product that has been through the Ozone cleaning process. In addition this alternative cleaning process is more cost effective and environmentally friendly. If you’re interested in using Modutek’s Ozone cleaning (stripping) process at your manufacturing facility contact them at 866-803-1533 for a free quote or email [email protected].

Modutek’s Chemical Fume Hoods: Ordering Made Easy

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Modutek-Chemical-Fume-HoodsWhen it comes ordering chemical fume hoods for your lab, Modutek gives you a wide variety of options to meet your requirements. With our wet processing capabilities, we can add the features you require that give you flexibility and overall design advantage. Whether you require a table top exhaust hood or a freestanding hood supported with a HEPA filter filtration system, Modutek can customize our equipment to meet your specifications and requirements.

There are no catalog numbers to limit your choices. All lab and research projects have their own unique equipment requirements. We are your one-stop shop that can provide all your lab equipment needs for all types of wet processing, wet bench and related manufacturing. Below are the features and benefits of Modutek’s chemical fume hoods and how we make ordering easy:

  • Modutek’s chemical fume hoods are made from high-quality materials. This includes stainless steel construction to handle solvent applications and white polypropylene to handle acid and base processes.
  • Each unit is manufactured having electrical outlets at deck level. The units can be manufactured using standard, ground-fault circuit interrupter (GFI) or explosion proof electrical outlets. GFI outlets are required in most states since they provide the best protection from electric shock. Explosion proof electrical outlets are used in hazardous and corrosive environments. Choose the outlet that best suits your manufacturing needs.
  • If you need a chemical fume hood built with a utility sink with a gooseneck faucet, we offer that option. This type of faucet is an option many of our customers choose as part of their requirements.
  • Temperature controlled chemical baths are also available with our chemical fume hoods or exhaust stations for your laboratory.
  • Modutek’s chemical fume hoods can also be designed with overhead fan filter units (FFU) if they are part of your requirements.
  • A carboy chemical containment system is included with our chemical fume hoods. This system captures waste solvents produced during wet processing, and other related chemical processing applications.
  • Counter balanced safety shields are also provided with the chemical fume hoods manufactured by Modutek.
  • Overhead LED lighting is also included on-deck.
  • Custom designed chemical fume hoods built per your specifications. What does your specific application require? What size and length chemical fume hoods do you need? We can create any size and length to meet your requirements.

Other options you can get on your Modutek chemical fume hood include dedicated drains to carboy with DOT containment, lift stations designed into the benches, fan filter units (HEPA), Teflon N2 gun and DI water hand spray, and extended warranty. If you need additional information on Modutek’s chemical fume hoods you can contact us at 866-803-1533.

Chemical Fume Hoods – Using Technology to Keep Workers Safe

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Chemical Fume Hoods are necessary for businesses that use caustic chemicals or cleaners that are hazardous for those working around them. Modutek Corporation, which has been in business since 1980, manufactures some of the best Chemical Fume Hoods available today.

Properly designed and installed Chemical Fume Hoods are necessary to reduce a lab worker’s exposure to hazardous fumes, vapors, gases and dust created during lab tests. They are also used for Research and Development (R&D) analysis and in University laboratories. A Chemical Fume Hood works by confining any hazardous airborne material as well as diluting it with large amounts of air. This is drawn through an exhaust and filter system which is then expelled through the roof of a building or, if a company chooses a ductless system, the air is filtered and re-circulated.

Chemical Fume Hoods designed and manufactured by Modutek are used in a variety of applications in a number of different industries. They can remove and filter smells, fumes, gases, airborne chemicals, dust and other related airborne contaminants. Modutek’s Chemical Fume Hoods provide quick and low-cost hazardous chemical exhausting to keep your work area safe for your employees.

Some of the benefits of using the Modutek’s Chemical Fume Hood system include:

  • Low-cost of ownership that comes with a one-year warranty on all parts; however an extended warranty is available.
  • Meets or exceeds all current industry safety standards.
  • Our Chemical Fume Hoods are easy to install and set up.
  • Chemical Fume Hoods can be designed to meet your current testing needs.
  • We work closely with each client to setup a specific custom design or configuration.
  • The equipment is designed to allow for future expansion.

There are a number of options available for Modutek’s Chemical Fume Hoods including a ductless fume hood design that collects fumes directly from the source and re-circulates the filtered air. The ductless application comes with carbon filter, dust filter or can be used with fume/air scrubbers. Ductless Chemical Fume Hoods can be used with a fume/air scrubber or other similar filters and do not evacuate air to the outside.

Other options for the Chemical Fume Hoods designed and manufactured by Modutek include, but are not limited to:

  • FM4910 (PVC-C) material of construction
  • Utility sink with gooseneck faucet
  • Easily accessible electrical outlets at deck level
  • Fan Filter Units (HEPA)
  • A lift station designed into the bench
  • Drains dedicated to carboy with DOT containment
  • Overhead deck lighting
  • Teflon N2 gun and DI water hand spray
  • Counter balance safety shields

If you would like more information about the Modutek Corporation Chemical Fume Hoods, or any of our other products, please contact us today at 866-803-1533.