How Megasonic Cleaners Improve Silicon Wafer Manufacturing

The cleaning of silicon wafers is one of the key process steps needed in semiconductor manufacturing. This as become even more critical as micro circuit geometrics continue to shrink on 300 mm silicon wafers. Sub micron particles must be removed from the wafer substrate without damaging the delicate microcircuit structures from previous process steps. Particles that remain may result in defective semiconductor components that don’t work or low quality devices that have sub-par performance.

Incorporating Megasonic cleaning technology in the wafer cleaning process effectively removes sub-micron particles and contaminants without damaging or altering the wafer surface. In order to clean effectively selecting the appropriate frequency and power level is important. Modutek has partnered with Kaijo Shibuya Corporation to incorporate their high frequency Megasonic cleaning systems directly into Modutek’s wet bench process equipment. The wet bench stations combine chemical cleaning processes such as RCA or SC1 with Megasonic cleaning in the megahertz range to remove particles and contaminants down to 0.1 microns. Depending on the cleaning temperature and duration, cleaning efficiencies of over 99 percent can be achieved.

How Megasonic Cleaning Technology Works

Megasonic cleaning systems use a high frequency generator to create high frequency sound waves through the use of a transducer that is immersed in a liquid filled cleaning tank. The compression waves that are generated from the sound create high pressure at their peaks and low pressure at their troughs. Small cavitation bubbles appear in the low-pressure troughs and collapse in the high-pressure peaks. The action of the bubbles in the liquid effectively removes contaminants and particles from the exposed surfaces.

Lower ultrasonic frequencies in the 20-100 kHz range produce relatively large energetic cavitation bubbles which can cause damage to delicate part surfaces. For applications associated with semiconductor cleaning, megasonic cleaning in the megahertz range is required since it generates much smaller energetic cavitation bubbles. The gentle cleaning action from bubbles at the megasonic frequency range will effectively clean without damaging the wafer surface.

The action of cavitation bubbles in the cleaning tank will also agitate the cleaning solution which reduces boundary layers and allows the cleaning solution access very small surface areas such as crevices and complex shapes. The use of megasonic cleaning in silicon wafer manufacturing improves the overall effectiveness of the chemical cleaning solution by removing small sub-micron particles through the action of energetic bubbles.

Modutek’s Use of Megasonic Cleaning

Modutek has used their partnership with Kaijo Corporation to continually improve the cleaning performance of their wet benches by using Kaijo’s Megasonic Cleaning technology. Kaijo is a world leader in megasonic and ultrasonic cleaning systems and Modutek incorporates the Quava megasonic cleaning system generator into their wet bench stations for this application.

The Megasonic cleaning system incorporated within Modutek’s wet bench station utilizes Kaijo’s standard megasonic generator which operates at 950 kHz. Frequency ranges of 200 kHz, 430 kHz, 750 kHz as well as 2 MHz are also available for cleaning applications that require a more or less robust cleaning action. There are three versions of Megasonic cleaning systems available which provide power levels of 600, 900 or 1200 Watts.

Modutek incorporates the use of Megasonic cleaning into their wet benches using either indirect or direct bath designs. Indirect Megasonic cleaning can operate at temperatures of up to 140 degrees centigrade while the direct design places a Teflon-coated transducer directly into the tank and can operate at temperatures up to 70 degrees centigrade. Both design options provide optimal sub micron particle removal without causing cavitation damage to the silicon wafers at the standard 950 kHz frequency.

Process engineers at semiconductor manufacturing fabs have effectively used Modutek’s wet benches stations that incorporate the use of megasonic cleaning to improve semiconductor device yields. The time needed for cleaning wafers is reduced while cleaning effectiveness is higher with less chemical consumption. The use of Megasonic technology has improved the removal of small sub-micron contaminants and has reduced wafer defects to produce better quality semiconductor devices. If you need to improve wafer manufacturing processes and device yields call Modutek for a free consultation or quote at 866-803-1533 or email [email protected].

Why Particle Removal is Essential in Silicon Wafer Cleaning

During silicon wafer processing, impurities and particles are deposited on wafer surfaces or are left over from previous process steps. Such particles can cause defects in the final semiconductor product. With the reduced size of today’s silicon wafer microstructures, even the tiniest particles can block etching and affect the diffusion processes. The result appears in the final semiconductor circuit as either as a defect or reduce quality and life expectancy of the product. As a result, the focus of many wafer cleaning operations is to leave the silicon wafer surface intact but free of contaminating particles.

How Particles are Removed from Silicon Wafer Surfaces

The removal of particles can be difficult because they often have a chemical or electrostatic affinity for the silicon surface. They are attracted to the silicon wafer because of electrostatic charges and specific mechanisms have to be used to dislodge and remove them. The smaller the particle, the more such attraction may play a role and the harder it is to remove every particle from the wafer.

Mechanisms to remove particles include silicon wafer cleaning with a chemical that reacts with the particles, cleaning with a solution that dissolves the particles or washing the particles from the wafer surface. In each case, a specific type of equipment is required and traditional standard processes can be used together with new technologies aimed at removing even the smallest particles.

Cleaning Processes

Many chemical processes used to clean silicon wafers have remained unchanged since they were first used 30 years ago. These methods use aggressive chemicals to remove contamination from the wafers, which are then rinsed with de-ionized water and dried. These methods remove most of the contaminants but are less effective in removing the smallest particles. Refined older methods and new technologies such as megasonic cleaning are now often used to complete the cleaning process.

Cleaning methods used at different stages of the silicon wafer fabrication process include the following:

  • The RCA clean process, often carried out in two steps called SC1 and SC2, prepares a wafer for further processing. SC1 cleans wafers with a mixture of ammonium hydroxide and hydrogen peroxide to remove organic residue. SC2 uses hydrochloric acid and hydrogen peroxide to remove metallic residues and particles.
  • The Piranha cleaning process removes large amounts of organic residue such as photoresist. It uses sulfuric acid and hydrogen peroxide in a particularly corrosive mixture that acts quickly but must be handled with care.
  • Megasonic cleaning dislodges particles and other contaminants using microscopic cavitation bubbles generated by a megasonic cleaning system. The bubbles form and collapse in time with the MHz sound waves, delivering a scrubbing action that overcomes particle attraction to the silicon wafer surface.
  • The Ozone cleaning process uses ozone to convert organic particles and contaminants to carbon dioxide. All organic traces on a wafer surface are completely removed, leaving the silicon wafer free from particles.

One of the most critical processes for silicon wafer cleaning is the pre-diffusion clean process that takes place just before the wafers are placed in the diffusion oven. Any of the above methods or a combination of cleaning methods can be used to ensure that wafers are free of particles and the diffusion will be even and consistent.

Equipment Used for Wafer Cleaning

Modutek’s wet bench technology supports all the above cleaning methods and can be provided within their manual, semi-automated or fully automatic systems. The company can offer equipment for traditional cleaning and for the new megasonic and ozone methods as well. All cleaning equipment is available in standard configurations but Modutek can also design custom products to meet the needs of any of their customers’ silicon wafer cleaning requirements. If you need highly reliable equipment to support your semiconductor manufacturing processes call Modutek for a free consultation or quote at 866-803-1533 or email [email protected].

 

How Megasonic Cleaning Improves the Silicon Wafer Cleaning Process

How Megasonic Cleaning Improves the Silicon Wafer Cleaning ProcessAs silicon microscopic circuits and structures shrink in size, the elimination of contaminants from becomes increasingly important. When silicon wafer cleaning is effective, it removes particles as small as 0.1 µm to prevent them from affecting the silicon fabrication process. Traditional wafer cleaning with chemicals may leave some of the smallest particles in place and production line output quality can suffer. The semiconductor components produced may be of inferior quality or fail completely. Megasonic cleaning with sound waves in the MHz range generated in a water cleaning solution can remove particles down to 0.1 µm in size and improve cleaning performance.

How the Megasonic Process Cleans

The Megasonic Cleaning System consists of a high-frequency generator, transducers that convert the electric signal from the generator to sound waves in the water, and a cleaning tank to hold the cleaning solution and the silicon wafers. Sound waves in the MHz frequency range travel through the cleaning liquid and generate microscopic cavitation bubbles in the low-pressure wave troughs. When the bubbles collapse in the high-pressure wave peaks, they produce tiny jets of water.

When the bubbles collapse near a wafer, the resulting jets hit the silicon and dislodge any particles adhering to the surface. The particles are carried away by the water currents and the microscopic bubbles are so numerous that all surfaces are cleaned. The bubbles and the cleaning effect are present throughout the liquid and they penetrate into holes, crevices and microscopic structures, cleaning completely.

Megasonic Cleaning Benefits

In addition to cleaning silicon wafers and removing microscopic particles more effectively than traditional cleaning methods, Megasonic Cleaning provides several other benefits over the use of chemicals. The rise in output quality is accompanied by lower costs, a safer process environment and shorter process times.

When a semiconductor fabrication facility uses fewer chemicals for cleaning wafers, costs decrease. The facility has to purchase smaller amounts of chemicals, storage costs are lower and costs for disposal are less. Depending on the process, Megasonic Cleaning may allow a facility to eliminate certain chemicals completely, resulting in even higher savings.

The Megasonic Cleaning process is safe and environmentally friendly. The megasonic waves and the cleaning solution do not present any danger to equipment or operators who can set a timer and come back when the cleaning process is finished. The water-based solution is not toxic and does not require special disposal. Compared to chemical cleaning, the storage and handling of Megasonic cleaning materials is safe and easy, power consumption is lower and less water is required.

Modutek’s Megasonic Cleaning System

The Modutek Megasonic Cleaning System was developed together with ultrasonic technology leader Kaijo Corporation to reflect the specific demands of silicon wafer cleaning. The high operating frequency in the MHz range ensures gentle but effective cleaning of delicate materials without pitting the silicon surface or damaging the silicon wafer structures.

Modutek’s partnership with Kaijo lets the company offer an integrated system that features the Quava Megasonic generator and transducer within Modutek’s cleaning baths. Megasonic’s baths are available in the indirect heating MSI series that can heat the cleaning solution up to 140 degrees centigrade while the direct heating MSD series can heat the cleaning solution up to 70 degrees centigrade. Both baths are ideal for submicron particle removal with a high power density and high efficiency.

The Megasonic System is available with 600 W, 900 W and 1200 W power ratings at the standard 950 kHz frequency. Frequencies of 200 kHz, 430 kHz, 750 kHz and 2 MHz are also available for applications that require the more robust cleaning action from the lower frequencies or for very delicate components at the higher frequency. In any case, Modutek can advise customers to make sure they select the ideal Megasonic Cleaning configuration for their specific silicon wafer cleaning applications.

How Megasonic Cleaning Technology Improves Silicon Wafer Yields

How Megasonic Cleaning Technology Improves Silicon Wafer YieldsSilicon wafer cleaning is a key process during semiconductor manufacturing that becomes especially critical for smaller microcircuit geometries on 300 mm (approx. 12 inch) silicon wafers. Sub micron particles must be removed from the wafer substrate during processing without damaging the delicate microcircuit structures. Any particles that remain may result in defective semiconductor components or output of low quality.

A process incorporating Megasonic Cleaning technology at higher megahertz frequencies can help remove tiny particles and contaminants without damaging or altering the surface of the wafer. The selection of appropriate frequencies and power levels is important for effective cleaning results. Modutek has partnered with leading ultrasonic cleaning system provider Kaijo Corporation to incorporate Kaijo’s high frequency Megasonic Cleaning technology into the Modutek wet bench process equipment. These wet benches can combine chemical cleaning processes such as SC1 with megasonic cleaning in the megahertz range to remove a high percentage of 0.1 to 0.4 micron particles. Depending on cleaning times and temperatures, cleaning efficiencies of over 99 percent can be achieved.

How Megasonic Cleaning Works

In megasonic cleaning systems, a megasonic frequency generator produces high-frequency sound waves in a liquid via a transducer immersed in a liquid bath. The sound waves are compression waves that generate high pressure at their peaks and low pressure in their troughs. Cavitation bubbles appear in the low-pressure troughs and collapse in the high-pressure peaks. This bubble action in the cleaning liquid removes contaminants from exposed surfaces.

Low ultrasonic frequencies in the range of 20 to 40 kHz produce comparatively large, very energetic bubbles whose collapse can cause cavitation damage to delicate surfaces. For semiconductor cleaning applications, megasonic frequencies in the MHz range generate much smaller, less energetic bubbles. Their gentle cleaning action does not damage the wafer surface while still cleaning effectively.

At the same time, the bubbles agitate the cleaning solution, reducing boundary layers and promoting cleaning solution access to small surface features such as crevices and complex shapes. Using megasonic cleaning in silicon wafer manufacturing improves the effectiveness of the chemical cleaning solution by removing small sub-micron particles through the action of energetic bubbles.

Modutek Megasonic Cleaning Systems

Modutek has been in partnership with Kaijo Corporation to improve the cleaning performance of their wet benches by incorporating the use Kaijo’s Megasonic Cleaning technology. Kaijo Corporation is a world leader in megasonic and ultrasonic cleaning systems and Modutek incorporates the Quava megasonic cleaning system generator into their wet bench equipment for this application.

Modutek’s Megasonic Cleaning System that utilizes Kaijo’s megasonic generator operates at 950 kHz in the standard version. Frequencies of 200 kHz, 430 kHz, 750 kHz and 2 MHz are also available for cleaning applications that require a more or less robust cleaning action. The Megasonic Cleaning System can operate at power levels of 600, 900 or 1200 W.

Modutek has incorporated Megasonic Cleaning into their wet benches in either indirect or direct bath designs. Indirect Megasonic Cleaning can operate at temperatures of up to 140 degrees centigrade while the direct design places a Teflon-coated transducer directly into the tank and can operate at up to 70 degrees centigrade. Both designs offer optimal sub micron particle removal without cavitation damage to the silicon wafers at the standard 950 kHz frequency.

Decision makers at semiconductor manufacturing facilities can use Modutek’s wet benches that incorporate the use of megasonic cleaning technology to improve yields. Cleaning times are reduced while cleaning effectiveness is higher and lower chemical consumption can contribute to better cost control. Improved removal of small sub-micron contaminants and particles can reduce wafer defects and produce better quality output. If you need to improve wafer processing quality and yields and want a free consultation or quote on using wet bench stations that incorporate megasonic cleaning technology, call Modutek or email [email protected].

Silicon Wafer Cleaning: Effectively Removing Contaminants to Improve Yields

Silicon Wafer Cleaning: Effectively Removing Contaminants to Improve YieldsSuccessful semiconductor manufacturing relies on the effective cleaning of silicon wafers at several stages of the manufacturing process. Impurities, contaminants and residues from process steps have to be completely removed to ensure that the manufactured components have the required functionality and the desired quality. Silicon wafer cleaning equipment such as those offered by Modutek helps increase yields and improves the cleaning process to deliver high quality results.

RCA Cleaning

Standard RCA cleaning, named after the RCA Corporation where it was developed, involves immersion of the silicon wafers in hot acidic and alkaline solutions. The first bath usually contains hydrogen peroxide and ammonium hydroxide while the second bath has hydrogen peroxide with hydrochloric acid. The first solution removes organic contaminants from the surface of the silicon wafers by dissolving the bonds binding the contaminant particles to the silicon and by the oxidizing action of the chemicals. The second solution dissolves and removes alkaline residues and metallic particles.

RCA cleaning is the most common cleaning method used in the semiconductor manufacturing industry. It is especially effective in removing particles responsible for defects in semiconductors. When detected, such defects reduce the semiconductor yields of the manufacturing process and, if not detected, they reduce the quality of the resulting components.

Megasonic Cleaning

Cavitation bubbles created by the use of megasonic cleaning systems complement the chemical cleaning action of RCA cleaning. As semiconductor geometries become smaller and smaller in size, microscopic particles become more important in the creation of defects. Particles that might be too small to impact the function of large components become critical defect-producing factors for the smallest semiconductor structures.

The bubbles of megasonic cleaning systems add a mechanical component to the overall cleaning action. When the cavitation bubbles burst, they release energy that helps dislodge contaminant particles from the silicon substrate. This mechanical cleaning action can speed up the overall cleaning process and make it more effective in removing even the smallest particles.

SPM Clean – Piranha Etch

When silicon wafers are heavily contaminated, for example when contaminants are clearly visible or for the removal of photo resist after wafer processing, piranha etches provide a powerful cleaning method. The cleaning solution is made up of a mixture of hydrogen peroxide and sulphuric acid. The solution is highly corrosive and yields aggressive cleaning to remove large amounts of material. Sometimes wafers can be run through a piranha etch treatment before further cleaning with the RCA method.

FEOL and BEOL Processing

Front End of Line (FEOL) processing is the part of semiconductor manufacturing in which the components, such as transistors, are created in the semiconductor wafer, while Back End of Line (BEOL) processing involves depositing the metallic interconnections. Cleaning may be required after etching, after ion implantation or after metal deposition to remove process residue.

Water-based cleaning removes some of the impurities and RCA cleaning or piranha cleaning may be used to remove masks, photo resist or chemical residue. Ultrasonic cleaning is effective in helping remove particulate contaminants and ozonated deionized water may be used as well. At the end of each cleaning process, the wafers may be dried with isopropyl alcohol (IPA) in preparation for further processing steps.

Silicon Wafer Cleaning Equipment

Modutek has specialized in silicon wafer cleaning equipment for the semiconductor manufacturing industry and can deliver a complete spectrum of semiconductor cleaning solutions. In addition to chemical cleaning stations, Modutek incorporates the use of Megasonic cleaning equipment and IPA dryers.

Modutek silicon wafer cleaning solutions are based on the company’s thirty years of experience in providing semiconductor manufacturing equipment to the semiconductor industry. Modutek’s team of engineers can advise customers on the choice of equipment and design custom cleaning solutions for a wide variety of applications. If you need reliable and effective silicon wafer cleaning equipment in your manufacturing process, contact Modutek at 866-803-1533 or email [email protected].

Modutek At Semicon Conference in China

Modutek At Semicon Conference in ChinaModutek, a leading provider of leading-edge wet benches and wet process equipment, will have a factory representative at the Semicon Conference in Shanghai China from March 15-17, 2016. Modutek will be with their China Rep Laserwort located in Hall N3 at booth 3401. Information about the Semicon Conference can be referenced at http://www.semiconchina.org/ and details on Modutek’s attendance at the conference can be referenced at: Modutek at Semicon Conference in China

Stop by the Modutek /Laserwort booth to get information and answer any questions you have about Automated, Semi-Automated and Manual Wet Process Stations used for acid/base, solvent and ozone cleaning or photo resist strip. Modutek also provides IPA vapor drying and Megasonic cleaning equipment to support your manufacturing applications. In addition environmentally friendly acid neutralization systems and air scrubbers are available with all their equipment.

Additional details on some of Modutek’s products are listed below:

  • Fully-automated Wet Bench Equipment
    • Benefits include:
      • Full automation control with touch screen
      • SolidWorks Simulation Professional software
      • SolidWorks Flow Simulation software
      • Servo motor automation
      • All robotics and software designed in house
      • Complete design, assembly and test done according to your specifications
  • Semi-automated Wet Bench Equipment:
    • Benefits include:
      • Automation control with touch screen
      • SolidWorks Simulation Professional software
      • SolidWorks Flow Simulation software
      • Servo motor automation
      • All robotics and software designed in house
      • Complete design, assembly and test done according to your specifications
  • Manual Wet Bench Equipment:
    • Benefits include:
      • High end manual equipment at competitive pricing
      • Meets or exceeds all current safety standards
      • Designed to meet any process requirements
      • Can accommodate custom designs and processes
      • Low cost of ownership
      • Equipment designed for future expansion

Our fully-automated, semi-automated and manual wet bench equipment supports the following applications:

  • KOH Etching
  • Quartz cleaning
  • Ozone Etching
  • Ozone Cleaning
  • SC1 & SC2 featuring Megasonic Cleaning
  • BOE (Buffered Oxide Etching)
  • MEMs processing
  • Plating
  • All solvent applications
  • Hot phosphoric (Nitride Etching)
  • SPM Cleaning
  • Precision Part Cleaning
  • IPA Vapor Dryer
    • Benefits include:
      • Very low IPA consumption
      • No moving parts inside drying chamber which eliminates wafer breakage
      • Most drying cycles completed within 10-15 minutes
      • No watermarks
      • Drying technology can be easily designed into your wet bench eliminating one transfer step
    • The IPA Vapor Dryer supports the following applications:
      • Ozone Cleaning
      • Wafer Drying

Modutek has over 35 years of experience developing and building wet bench stations and wet process equipment that provides highly reliable results for precision processes. They also provide world-class service, and customer support. Call 866-803-1533 or email [email protected] for a free quote or consultation to discuss your requirements.

How Standard Clean Particle Removal (SC1 Clean) is Supported in a Wet Bench Process

How Standard Clean Particle Removal (SC1 Clean) is Supported in a Wet Bench ProcessSC1 Clean is the first step in the RCA clean, the procedure required before the high-temperature processing of silicon wafers. Organic impurities attached to silicon, oxide and quartz surfaces by the solvating and oxidizing actions of NH4OH and H2O2 respectively are eliminated by the particle removing solution, SC1 Clean. This solution starts a slow regeneration process whereby the silicon wafer’s original surface layer of oxide is broken down and replaced with a new layer. This regeneration process is a highly significant part of particle removal.

SC1 solution is used at 75 or 80°C for approximately 10 minutes. It is composed of:

  • 5 parts deionized water
  • 1 part NH4OH
  • 1 part H2O2

The cleaning procedure begins by heating a mixture of the deionized water and NH4OH up to 75°C. Then, add H2O2 and allow the mixture to bubble violently before using. The silicon wafer will then be soaked in the solution for 15 minutes. After, rinse the silicon wafer in a container of deionized water in order to clean off the solution. You should change the water several times in order to prevent any removed residue from clinging back on to the surface of the silicon wafer. Remember, with the new oxide layer on the surface comes an iron contamination that should be cleaned off in the following steps of the RCA clean.

Modutek Megasonic Cleaning Equipment and Features

The particular demands of the semiconductor, FPD, hard disk, solar and crystal industries are met by Modutek’s precision megasonic cleaning system. In addition, partnering with Kaijo Corporation allows Modutek to supply engineers with cutting-edge high precision cleaning technology.

You can clear 0.1 µm particles while working up to 140°C with Modutek’s Indirect (MSI Series) bath design. Or, Modutek’s Direct (MSD Series) can give you identical results with the Teflon coated Megasonic transducer. Placed in the tank, the transducer plate is ideal for using SC1 Clean and is easily accessible for installation and upgrades. With the help of Modutek’s engineers, your manufacturing equipment will be designed to work according to the requirements of your application.

Modutek’s Megasonic cleaning features include:

  • Automatic frequency tracking system
  • High efficiency generator
  • Upper and lower limit controls
  • Available frequencies: 950kHz, 2MHz, 750kHz, 430kHz and 200kHz

Modutek’s Experience

Modutek has been in the business of supplying semiconductor manufacturing equipment for 30+ years. This history is sustained by associates who will work with you from design to final installation. For a free quote call 866-803-1533.

Tips on Buying Silicon Wafer Cleaning Equipment

Tips on Buying Silicon Wafer Cleaning EquipmentFor all manufacturing involving semiconductors and micro electrical mechanical systems (MEMs), one of the most important requirements is to maintain a precise cleaning process of silicon. This reduces yield problems that occur from both the organic and inorganic residues. As the size geometry and size of semiconductors continue to become smaller, there are higher risks associated with contamination of wafers especially by particle contaminators. For increased efficiency in your manufacturing processes you will need to purchase high quality and reliable silicon wafer cleaning equipment for your manufacturing facility.

Here are 5 factors to consider when shopping for silicon wafer cleaning equipment:

  • Buy from a company with experience and expertise

Silicon wafer cleaners are different from other products you will buy on the market and fit into manufacturing environment.  When you are purchasing this equipment you will need to look for a company that has a proven track record with in-house expertise and support. You also need to confirm that the equipment they provide will meet all of your manufacturing requirements.   Upcoming companies with little experience are likely to sell you substandard products or products that are not fully qualified to meet your requirements. Companies that have been in the field for a long time will offer various equipment options based on their experience working with various customers.

  • Buy equipment manufactured using the latest technology

As the quality and geometry of the MEMs and semiconductors advance, the technology used to make wafer cleaners have also advanced. Finer geometries require finely washed and cleaned silicon unlike in previous years which involved just simple immersions in hot alkaline. The modern cleaning equipment uses megasonic cleaning, centrifugal spraying, and ultrasonic cleaning technologies. The enclosed systems effectively clean all particles and contaminant films. You’re better off buying from a company that implements such advanced technology.

Photoresists require sophisticated cleaning methods like the piranha cleaning process which uses a mixture of sulfuric acid and hydrogen peroxide to clean organic residues off substrates. This process requires that the equipment and procedure used be carefully followed to insure safety.

  • Confirm that the equipment supports user manufacturing requirements

Cleaning equipment will always feature different cleaning aspects. You should check the manufacturer’s specifications to ensure that they match your requirements to ensure optimization of the resource. Wafer cleaners with additional features may be unnecessarily expensive if you never use some of the features.

  • High quality and reliable tools

Money will always be a factor when it comes to purchasing wafer cleaning equipment, but quality and reliability must never be compromised. High quality and reliable equipment will last longer, work better and will not compromise the reputation of the manufacturer.

  • Buy from a company that offers technical support and onsite repair

Many companies will sell you a product, but will not always offer good technical support and onsite repair if there is a problem. If a manufacturer does not offer good technical support or if the system does not work reliably, your manufacturing yields will be compromised. It is advisable to buy from a company that will offer technical support and repair of their wafer cleaning equipment in case of breakdown or malfunction.

Summary

With these factors in mind, work with a manufacturing supplier that provides reasonably priced yet effective silicon wafer cleaning equipment that is both efficient and durable. At Modutek Corporation, we strive to do this for all our customers and have been providing the high quality of equipment, service and support for over 30 years. Call us for a free quote at 866-803-1533 or visit our site at www.modutek.com.

Batch Etching Processes Supported by Modutek’s Wet Processing Equipment

Batch Etching Processes Supported by Modutek's Wet Processing EquipmentModutek is one of the premier developers of semiconductor manufacturing equipment as well as wet bench solutions. They pride themselves on more than 30 years of continuous operation and for their high level of customer satisfaction when it comes to providing superior wet processing equipment and service solutions. This experience results in quality and reliability that puts customers first each and every time!

The services and products offered by Modutek are ideal for process engineers and facilities engineers who want and need to use reliable equipment that provides a consistent repeatable process in a high tech manufacturing environment. Their customers include semiconductor fabs, university and research facilities manufacturing semiconductors, solar flat panels, LED displays, hard disk drives, and other related products. Modutek’s in-house engineering team can design and tailor their manufacturing and other wet processing equipment to meet all the requirements that their customers would require to achieve best results.

Modutek’s experienced team of engineers and knowledgeable sales team, can help you find the most effective and affordable solution for all of your wet processing equipment and manufacturing needs. Customer satisfaction runs high and they are known for their excellence in providing quality and reliable services, training, equipment, and machinery – which always has been and always will be their first priority.

Services and Features

Modutek’s Semiconductor Manufacturing Equipment and Wet Bench Expertise provides the following services and features:

  • Buffered Oxide Etch Services
  • Chrome Etch Options
  • Customized Flat Panel Display
  • Specialized Processes for Etching
  • KOH, LED, and MEMS Processes
  • Metal Etching and Wet Processing Equipment
  • High Quality Acid Neutralization
  • Plating Guidance and Services
  • Positive Resist Strip
  • Precision SC1 & SC2 Cleaning
  • Solar and Chemical Polishing

Modutek Equipment and Services

Modutek provides outstanding services and high quality equipment and machinery that meet their customer’s requirements to provide the best results. Below are four of the most popular products available:

Wafer Rotary Etching System: This specialized model offers an affordable, ergonomic, safe, and fully automated batch processor. The system is designed for a variety of uses including developing, stripping, precise chemical etching, wafer reclamation, and a variety of cleaning and processing needs.

Vacuum Metal Etcher: As a fully automated batch processor, this etcher is designed to make use of the wet chemical etching process and is specially designed for optimum results on the aluminum surfaces found on the wafers. The etching is done under in vacuum environment so any hydrogen bubbles created by the process, are removed before they cause flaws and issues with the wet processing equipment etching.

IPA Vapor Dryer: This is a system that yields a very competitive option when it comes to a variety of drying requirements. One drying chamber is all that is needed for optimum drying and finishing. With this special set up, IPA vapor is generated in a compact and easy system that makes reloads and changes very easy and quick.

Megasonic Cleaning Equipment: With this set up you get a platform and design that provides a cleaning system that has been specially developed with the Semiconductor, Solar, FPD, Hard Disk, and Crystal industries in mind. This is one of the few places that has the latest Megasonic advances available to customers and clients before anyone else!

It is easy to see why Modutek is a trusted provider when it comes to semiconductor manufacturing equipment and wet processing equipment. Whatever your business needs may be and whatever the scope of your field is, you can find a solution at Modutek. Contact them at 866-803-1533 for a quote or to ask any questions about their equipment and your manufacturing requirements.