Wet Bench Manufacturer | Wet Process Equipment | Modutek

Advantages of HF-Last Etching and IPA Drying in One Chamber


In the final stage of silicon wafer cleaning the silicon oxide layer has to be removed and the clean wafer dried without contamination. When wafers are removed from the HF etching process and transferred to a drying chamber, the extra handling increases the chances for wafers to pick up contaminating particles. Such particles cause errors […]