Category Archives: Wafer Cleaning Process

How the SPM Clean Process is Supported in a Wet Bench Process

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How the SPM Clean Process Is Supported in a Web BenchEditor’s Note: This article was originally published in Oct 2016 and has been updated with additional information and reposted in May 2023.

Semiconductor manufacturing involves multiple processing steps which include cleaning silicon wafers. The sulfuric peroxide mix (SPM) cleaning process is widely utilized in semiconductor manufacturing. The process utilizes a mixture of approximately 3 parts sulfuric acid to 1 part hydrogen peroxide which is highly effective at eliminating organic and inorganic contaminants from semiconductor wafers. The SPM process is typically performed in wet benches specifically designed for this cleaning process.

The SPM Clean Process

Sulfuric acid in the SPM solution reacts with organic contaminants like photoresist and residue, while hydrogen peroxide oxidizes and removes inorganic contaminants like metal ions and particles from semiconductor wafers. This reaction generates heat which helps to accelerate cleaning. Process engineers using the SPM process in semiconductor manufacturing need to make sure that the chemical ratio and temperature are maintained within safe limits and that the solution and wafers are contained safely in impervious baths. During the process concentration levels may vary from 3 to 1 to a maximum of 7 to 1 and the temperature used may be as high as 140 degrees centigrade. When the solution operating values are chosen, the baths should be maintained at those concentration and temperature values to keep the strip rate uniform.

Advantages of SPM Clean

SPM Clean offers several advantages over other cleaning methods. Its key advantage lies in its effectiveness at removing organic and inorganic contaminants simultaneously. The process is relatively quick usually taking just a few minutes. In addition, the SPM clean process does not damage or etch the substrate beneath, making it ideal for sensitive materials like silicon dioxide and silicon nitride.

Equipment for the SPM Process

SPM cleaning solutions are typically applied in a wet bench designed specifically to facilitate this cleaning method, typically composed of materials compatible with SPM solutions like polypropylene, Teflon, and quartz. Wet benches come equipped with safety features such as fume hoods, exhaust systems, and emergency shutoff switches to help minimize chemical exposure. For consistent and reliable results, SPM clean process equipment typically features process control and automation features to facilitate consistent operations. SPM solution concentration, temperature, and flow rate can all be carefully managed in order to ensure an efficient cleaning process. In addition, automated wafer handling systems may also help minimize contamination risks while improving process efficiencies.

Safety Considerations

To ensure the safe and effective implementation of the SPM Clean process in wet benches, certain practices should be observed. These include adhering to safety procedures, performing regular equipment and tool maintenance checks, optimizing cleaning process performance, and complying with local regulations for waste management and disposal.

Using the SPM Clean Process in Modutek’s Wet Benches

Modutek provides manual, semi-automatic, and fully automatic wet bench systems that support the SPM clean process. Wet Bench systems are available in a wide variety of configurations as well as in custom designs. The fully automated stations use Modutek’s in-house software for automatic process execution with high accuracy, reliability, and repeatability. The semi-automated stations can achieve similar results with robotic controls at a lower cost. The manual stations have the same safety and process features without the cost of automation.

Quartz Recirculating Baths

To work well, the SPM solution must be heated rapidly in a bath that can withstand high temperatures and that will not react with aggressive chemicals. Heating must be even and controlled within a narrow range. At high temperatures, hydrogen peroxide decomposes and the solution must be spiked with more peroxide to maintain its concentration.

Quartz recirculating baths fulfill all these requirements. The quartz can be manufactured in a pure enough form to withstand the temperatures and corrosion while the recirculation allows tight control of concentration with the addition of chemicals as required.

This spiking allows operators to use the solution for a longer period of time rather than discarding the solution when the concentration falls below acceptable levels. Re-using sulfuric acid for as long as possible reduces costs and is desirable from an environmental point of view as well.

Modutek Series QFa Series Quartz Baths

Modutek’s quartz baths support the SPM Clean process and satisfy key conditions for high safety and reliability as well as low cost of ownership. The tanks are made of semiconductor-grade flame-polished quartz and are insulated with high-density alumina-silica fiber rated to 1260 degrees centigrade. The four-sided heating element promotes fast, even heating and the seamless sloped flange and the dual safety snap switch help ensure safe and convenient operation.

The quartz baths have an operating temperature range of 30 to 180 degrees centigrade and they feature a standard heat-up rate of 2 degrees centigrade per minute. The operating temperature can be controlled to within plus/minus 1-degree centigrade and a liquid level sensor is available as an option.

Standard tanks are available in dimensions ranging from 7.75 to 21.5 inches inner side length and in square and rectangular formats. Depths range from 6.75 to 14.5 inches and available heaters are rated 2 to 6 KW. Modutek can design systems with custom vessel sizes to satisfy specific requirements.

The Bottom Line

Modutek’s wet benches and quartz baths are designed with low cost of ownership in mind while emphasizing features that reduce errors and improve reliability. Semiconductor manufacturers using the SPM process can achieve higher throughput and better output quality using Modutek’s equipment. Contact Modutek for a free consultation or quote on wet bench equipment to support your wafer cleaning processes.

How the Advanced Ozone Cleaning Process Improves Wafer Yields and Reduces Costs

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How the Advanced Ozone Cleaning Process Improves Wafer Yields and Reduces CostsEditor’s Note: This article was originally published in January 2017 and has been updated with additional information and reposted in April 2023.

Modutek’s advanced ozone cleaning is a highly effective method for removing contaminants from wafers. The process involves using ozone gas, which is a highly reactive oxidant, to break down and remove organic and inorganic contaminants from the surface of the wafer. The process is typically performed in a closed chamber that is designed to contain and recirculate the ozone gas.

How Advanced Ozone Cleaning Works

The advanced ozone-cleaning process works by exposing the wafers to a controlled amount of ozone gas. The gas is generated on-site using an ozone generator and is then injected into the cleaning chamber. The wafer is then exposed to the ozone gas for a specific amount of time, which can range from a few seconds to several minutes, depending on the type and level of contamination.

During the exposure time, the ozone gas breaks down and oxidizes the organic and inorganic contaminants on the wafer surface, converting them into carbon dioxide, water, and other harmless byproducts. The byproducts are then removed from the chamber through a ventilation system, leaving the wafer surface clean and free of contaminants.

The advanced ozone-cleaning process is highly effective at removing a wide range of contaminants, including organic and inorganic compounds, particles, and metals. Additionally, the process is environmentally friendly and does not generate any hazardous waste or byproducts. Overall, advanced ozone cleaning is a safe and effective method for removing contaminants from wafers, resulting in improved yields, reduced costs, and increased productivity.

Advantages and Benefits of Advanced Ozone Cleaning

Advanced ozone cleaning is a highly effective method for removing contaminants from wafers, which can significantly improve wafer yields and reduce manufacturing costs. Unlike traditional cleaning methods, such as wet cleaning and plasma cleaning, advanced ozone cleaning uses ozone gas to break down and remove organic and inorganic contaminants from wafers. In this article, we will discuss the benefits and advantages of using advanced ozone cleaning in the semiconductor manufacturing process.

Improved Cleaning Performance

One of the main advantages of using advanced ozone cleaning is its superior cleaning performance. Ozone gas is a highly reactive oxidant that can effectively remove a wide range of contaminants, including organic and inorganic compounds, particles, and metals. Compared to traditional cleaning methods, advanced ozone cleaning can achieve much higher levels of cleanliness, which can lead to improved wafer yields and reduced defect rates.

Reduced Chemical Usage

Another benefit of using advanced ozone cleaning is its reduced chemical consumption. Traditional cleaning methods often require large quantities of chemicals, which can be expensive and potentially hazardous. In contrast, advanced ozone cleaning uses only a small amount of ozone gas, which is generated on-site and does not require the storage or handling of hazardous chemicals. This can result in significant cost savings and reduced environmental impact.

Better Process Control

Advanced ozone cleaning also offers improved process control compared to traditional cleaning methods. By precisely controlling the amount and duration of ozone exposure, the cleaning process can be optimized for each specific application. This can result in improved process repeatability, reduced variability, and higher product quality.

Reduced Downtime

Using advanced ozone cleaning can also lead to reduced downtime and increased productivity. Traditional cleaning methods often require longer cleaning cycles and can result in extended equipment downtime. In contrast, advanced ozone cleaning can be performed quickly and efficiently, reducing the amount of time equipment needs to be offline. This can result in increased equipment utilization and improved manufacturing throughput.

Lower Cost of Ownership

Finally, advanced ozone cleaning can result in a reduced cost of ownership for semiconductor manufacturers. By improving wafer yields and reducing defect rates, advanced ozone cleaning can lead to increased revenue and reduced waste. Additionally, the reduced chemical consumption, improved process control, and reduced downtime can result in lower operating costs and increased profitability.

The Bottom Line

Advanced ozone cleaning is a highly effective method for removing contaminants from wafers, which can significantly improve wafer yields and reduce manufacturing costs. With its superior cleaning performance, reduced chemical consumption, improved process control, reduced downtime, and reduced cost of ownership, advanced ozone cleaning is an ideal choice for semiconductor manufacturers looking to improve their manufacturing processes.

Modutek Provides Solutions for Manufacturers

Modutek offers equipment for applying the ozone-cleaning process to semiconductor manufacturing and can help determine the ideal configuration for a particular application. The company also delivers equipment for traditional chemical bath cleaning methods and is therefore ideally placed to advise how the new ozone cleaning methods can improve production. Semiconductor manufacturers can take advantage of this capability to cut costs and increase productivity at their facility. Contact Modutek for a free consultation to discuss your specific process requirements.

How Piranha Etch is Used in Silicon Wafer Cleaning

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How Piranha Etch is Used in Silicon Wafer CleaningEditor’s Note: This article was originally published in December 2016 and has been updated with additional information and reposted in March 2023.

Silicon wafers are fabricated with repeated etching and cleaning steps to produce the micro-structures required for the final silicon semiconductor products. Piranha or SPM (sulfuric peroxide mix) solutions can clean organic material from wafers and oxidize most metals. The powerful chemical action that makes it a favorite for resist strip and for cleaning wafers with organic residue also makes it difficult to use. High-quality silicon wafer cleaning equipment designed to handle the corrosive chemicals safely is required for carrying out piranha etch safely and effectively.

What is Piranha Etch and How is it Used

Piranha etch is a highly corrosive mixture of concentrated sulfuric acid (H2SO4) and hydrogen peroxide (H2O2) commonly used in the microelectronics industry to clean and etch silicon wafers. It is called “piranha” due to its aggressive nature, similar to the ferocious piranha fish found in the Amazon River.

The most common ratio is approximately three parts acid to one part peroxide, but solutions of up to seven parts acid to one part peroxide are sometimes used. The solution is highly exothermic and is prepared by slowly adding the peroxide to the acid. The mixture heats up rapidly and is often used at temperatures of around 130 degrees C. Once the operating temperature and the desired concentration are reached, the wet bench equipment must heat the solution to maintain the temperature and keep the etch rate constant.

Piranha etch is primarily used to remove organic and inorganic contaminants from silicon wafers, which can negatively affect the performance of electronic devices. The highly oxidizing nature of hydrogen peroxide and the dehydrating property of sulfuric acid make piranha etch highly effective in removing photoresist residues, heavy metals, and other contaminants that may be present on the surface of silicon wafers. The underlying surfaces are hydroxylated, making them hydrophilic or attractive to water, a characteristic that can be used in subsequent silicon semiconductor manufacturing process steps.

Piranha Etch Process Steps

The process of using piranha etch involves several steps. First, the silicon wafer is rinsed with deionized water to remove loose particles or dust. Then, the wafer is immersed in a piranha etch bath for a short period, typically 10-30 minutes, depending on the level of contamination. During this time, the piranha etch reacts with the contaminants on the wafer, breaking them down and removing them from the surface.

After the piranha etch treatment, the wafer is rinsed several times with deionized water to remove any remaining piranha etch solution. It is important to note that piranha etch is a very dangerous substance and should be handled with extreme caution. The mixture is highly reactive, exothermic and produces toxic fumes that can cause severe burns and respiratory problems. Proper safety equipment, such as gloves, goggles, and fume hoods, should always be used when working with piranha etch.

Spiking the Piranha Solution to Maintain Concentration

When a facility wants to reuse a piranha solution for an extended period, the solution must be spiked with extra hydrogen peroxide. Hydrogen peroxide is unstable in the solution and decomposes, reducing the etching power of the bath. Spiking with additional hydrogen peroxide lets operators use a piranha solution for up to eight hours rather than replacing it every two hours. Spiking saves money by conserving sulfuric acid but requires wet bench equipment to handle the process and the spiking.

Modutek’s Silicon Wafer Cleaning Solutions

Modutek’s wet bench and silicon wafer cleaning equipment provide wafer cleaning solutions. The company can supply standard equipment or customize wet bench solutions to meet specific customer requirements. Priorities are high-quality materials, excellent designs, and low cost of ownership to achieve optimized process results. Piranha wafer cleaning is supported with Modutek’s QFa high-temperature recirculating Quartz Tanks and the QA constant temperature baths. Both can be installed in a wet bench station, and the process can be controlled automatically, semi-automatically, or manually.

The QFa series high-temperature re-circulating Quarz Tanks provide fast even heating over a temperature range of 30 to 180 degrees C. The heat-up rate can be up to 2 degrees C per minute, and the temperature control is up to plus/minus 1 degree C. The quartz bath is made of flame-polished semiconductor-grade quartz insulated with silica fiber rated up to 1260 degrees C.

The QA series constant temperature quartz baths are made from the same materials with the same control characteristics as the QFa series, but they feature a magnetic stirrer, an aspirator valve system, a gravity drain, and a quartz bubbler. Both baths are available in standard sizes or can be custom-made to fit customer requirements.

Modutek’s Equipment Provides Safe and Reliable Operation

Modutek can provide a complete range of silicon wafer cleaning equipment that includes baths suitable for piranha cleaning applications. The equipment is designed with safe and reliable operation in mind, and the cleaning equipment eliminates contaminants and impurities to the greatest extent possible. Modutek’s wet bench equipment allows operators to use piranha cleaning methods safely to increase facility throughput while maintaining or improving output quality. Contact Modutek for a free quote or recommendations on using the right equipment for your wafer cleaning application.

Why Pre-Diffusion Cleans Are Essential for Silicon Wafer Processing

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Why Pre-Diffusion Cleans Are Essential for Silicon Wafer ProcessingSilicon wafers must be completely clean before they go through the diffusion process. If contaminating particles are present on the wafer surfaces during the diffusion process, they will cause defects in the final semiconductor product. Pre-diffusion cleaning can be carried out with several methods. RCA clean and Piranha etch use chemicals to strip away wafer contamination. Megasonic cleaning uses high-frequency sound waves to dislodge surface contaminants and particles. No matter which cleaning method is chosen, cleaning must be done to reduce contaminating particle counts to a minimum. An experienced manufacturer of wet process stations can integrate the required cleaning methods into wet benches. They can then ensure that the silicon wafers are cleaned thoroughly.

RCA Clean is a Common Silicon Wafer Cleaning Method

RCA clean was originally developed at the RCA corporation and remains a popular all-round silicon wafer cleaning method. It consists of two parts: Standard Clean 1 and 2 (SC1 and SC2). SC1 removes organic material but leaves metallic contamination behind. SC2 cleans the remaining metallic particles and produces a completely clean wafer.

The SC1 cleaning bath contains a solution of ammonium hydroxide and hydrogen peroxide. The cleaning bath is heated to about 75 degrees centigrade, and the wafers are immersed for 10 to 15 minutes. All organic matter and many insoluble contaminants are removed, but some metallic ions stay attached to the wafer surface.

The metallic ions are removed during the SC2 cleaning step. The wafers are placed into a solution of hydrochloric acid and hydrogen peroxide. The solution is heated to about 75 degrees centigrade, and the wafers are immersed for about 10 minutes. Once the wafers are rinsed with deionized water and dried, they are ready for the diffusion processing steps.

Piranha Etch Quickly Cleans Heavy Contamination

When silicon wafers are heavily contaminated or need to be stripped of photoresist from previous process steps, a Piranha mixture is often used to begin the wafer cleaning process. The mix of sulfuric acid and hydrogen peroxide quickly removes large amounts of mainly organic contaminants. While it works more rapidly than RCA clean, it operates at an elevated temperature of 130 to 180 degrees centigrade and is hard to control precisely. Modutek’s proprietary “bleed and feed” process control improves process stability. The advanced controls allow for more precise temperature settings and better cleaning performance while maintaining the rapid removal of contaminants.

Megasonic Cleaning Provides Improved Removal of Contaminating Particles

Megasonic cleaning uses high-frequency sound waves in the cleaning bath to dislodge light contamination from wafer surfaces. The cleaning method features reduced use of toxic and expensive chemicals while reducing particle counts to a minimum. Even the smallest sub-micron particles can distort diffusion and cause defects in the final semiconductor product. These tiny particles are especially difficult to remove because they tightly adhere to wafer surfaces due to static charge and surface tension. Megasonic cleaning generates microscopic bubbles in the cleaning solution. When these bubbles collapse, the resulting scrubbing action removes the particles.

Modutek’s Wet Benches Support Pre-Diffusion Cleans for Specific Wafer Processing Requirements

Modutek wet process stations support all standard silicon wafer cleaning methods. Pre-diffusion cleans can be integrated into a wet bench to satisfy specific customer requirements. Since Modutek designs and builds equipment in-house, wet bench stations can be customized to meet specific customer needs. Based on its in-house expertise, Modutek can recommend solutions for wafer processing and propose equipment from its complete line of wet process stations. Once the equipment is built and delivered, Modutek can provide continuous customer support for the supplied stations. Contact Modutek for a free consultation to discuss your specific process requirements.

How Precise Control of the SPM Process Improves Processing Results

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How Precise Control of the SPM Process Improves Processing ResultsWhile the SPM (Sulfuric acid Peroxide Mix) or Piranha process quickly removes organic contaminants such as photoresist, it is difficult to control. The cleaning action depends on both the temperature and the concentration of the mixture. Both vary if the process is left to carry on without intervention. Better controls can improve cleaning performance, reliability, and repeatability while increasing the lifespan of the mixture. Modutek has developed advanced controls that maintain temperature and concentration precisely at their desired levels to improve cleaning results.

The SPM Process Suffers from Decreasing Concentration and Slower Cleaning

The SPM mixture is typically about three parts sulfuric acid to one part hydrogen peroxide. The preparation of the mixture is highly exothermic. Once the mixture stabilizes, the wafer cleaning process occurs in a heated tank at 130 to 180 degrees centigrade. The hydrogen peroxide is unstable and decomposes to form water and oxygen. As the amount of water in the mixture increases and the concentration of hydrogen peroxide goes down, the cleaning effectiveness of the mixture deteriorates.

Small amounts of hydrogen peroxide are periodically added to the mixture to correct the problem of a decreasing hydrogen peroxide concentration. This spiking with hydrogen peroxide causes a sudden temperature increase due to the exothermic nature of the mixing process. While spiking solves the problem of a decreasing hydrogen peroxide concentration, the temperature can’t be kept constant. An SPM mixture that is not spiked is useful for about two hours, but spiking with hydrogen peroxide increases the lifespan of the mixture to about one day.

Modutek Has Developed Advanced Controls to Improve Process Results

Modutek’s “Bleed and Feed” process control strategy keeps the concentration of hydrogen peroxide and the mixture temperature within narrow limits. The temperature variations due to spiking and the need for spiking are eliminated. With concentration and temperature controlled accurately, the strip rate of the mixture remains constant and predictable. Reliable timing and repeatability of the process are excellent.

Modutek achieves these results by using a two-tank control system. The process tank is the “dirty” tank, while the second tank is the “clean” tank. At periodic intervals, a small amount of the mixture is drained from the dirty tank. It is replaced with a fresh mixture from the clean tank. The clean tank mixture is then replenished with new chemicals. A programmable controller controls the process, so the dosage intervals and the amount of mixture to be drained are adjustable and recorded by the programmable controller. As a result, once the process controls are optimized, the SPM wafer cleaning process can be run exactly the same way each time.

Modutek’s “Bleed and Feed” Reduces Costs and Provides Benefits

Customers who have switched to Modutek’s “Bleed and Feed” controls find that their costs are reduced, and the process line performance is better. Modutek’s control strategy reduces chemical use, and the mixture lasts longer when the temperature variations caused by spiking are eliminated. Downtime due to having to replace the bath chemicals is reduced as well. The risk of accidents from operators adding too much hydrogen peroxide or from spills is eliminated. In addition to savings from lower chemical purchases, reduced costs include lower chemical handling, storage, and disposal expenses.

Support for the “Bleed and Feed” Process

Modutek offers the “Bleed and Feed” process controls for the SPM process on new wet process stations. As one of the leading semiconductor equipment manufacturers, Modutek continues to work on improving its silicon wafer cleaning equipment to meet customer needs. Since Modutek designs and builds its equipment in-house, innovative features can be developed to support unique customer requirements. Wet bench processes are often specialized, and Modutek can utilize in-house expertise to customize equipment as needed. Innovation and customization make Modutek a valuable partner for wet bench technology.

How Advanced Ozone Cleaning Reduces Costs and Improves Wafer Yields

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How Advanced Ozone Cleaning Reduces Costs and Improves Wafer YieldsWhen ozone is used to clean silicon wafers, it reduces the use of aggressive chemicals and it can decrease the wafer particle count. Modutek’s advanced ozone cleaning process can clean more quickly than many chemical-based processes and it delivers other benefits. Ozone is used to remove organic contaminants from wafer surfaces in either the Coldstrip sub ambient process or the Organostrip process. Either process can reduce overall wafer fabrication costs and improve manufacturing facility performance.

Advanced Ozone Cleaning Outperforms Chemical Stripping

With increased regulation of the use of dangerous chemicals and pressure on businesses to make their operations more environmentally friendly, Modutek developed the advanced ozone cleaning processes to help semiconductor manufacturers and research labs reduce chemical use. Ozone is introduced in Modutek’s DryZone system in compact units using the Coldstrip or Organo strip processes. Both cleaning methods also feature a reduced particle count compared to chemical cleaning methods.

In the Coldstrip process, wafers are first rinsed with deionized water to remove soluble non-organic contaminants. The process operates at four to ten degrees centigrade. After the rinsing, ozone is introduced into the chamber and combines with the carbon of the organic compounds on the wafer surfaces. The ozone-carbon reaction forms carbon dioxide, leaving wafers clean and almost free of particles.

The Organostrip process also uses ozone but operates at ambient temperature. Ozone is introduced into the process dissolved in acetic acid, a mild solvent in which ozone has a very high solubility. The wafers are rinsed with the ozone-acetic acid solution and the high level of ozone rapidly oxidizes the organic contaminants. The waste products of the process do not require special treatment. Both processes work quickly and feature excellent cleaning performance with low particle counts.

Changing to the Advanced Ozone Cleaning Process Delivers Substantial Benefits

The major benefits of changing from chemical cleaning to an advanced ozone cleaning process is a reduction in the use of toxic chemicals and improved cleaning performance with a lower particle count. These two factors are at the root of additional benefits resulting in cost savings, better yields and improved safety for employees.

Reduced Use of Chemicals

When the use of toxic chemicals is reduced, there are cost reductions in addition to savings resulting from fewer chemical purchases. Other savings include reduced costs for chemical storage, handling and disposal. Employees benefit from lower exposure to harmful chemicals and from increased workplace safety because there is less danger of spills or accidents.

Regulatory compliance costs are also reduced. As environmental regulations become more onerous, costs rise and compliance becomes more difficult. Reduced chemical use results in lower compliance costs, and a more environmentally friendly operation helps improve community relations and the environmental reputation of the business.

Lower Particle Contamination

Lower particle counts are the result of better cleaning performance. Particle counts play ang increasingly important role in wafer structures that are smaller and more tightly packed. Even a single particle can block a conducting path or the etching of a tiny detail. Fewer particles means a lower rate of defective products and higher yields. Product quality and longevity may also be improved.

Improved Cleaning Performance and Wafer Yields with Less Equipment

In addition to a lower particle count, the improved cleaning performance of the advanced ozone cleaning process results in shorter cleaning times within a smaller footprint. Modutek’s DryZone units used for the ozone cleaning process are compact and take up less space than the corresponding chemical cleaning stations. Cleaning is more rapid resulting in higher throughput. As a result of these benefits, the overall performance of the silicon wafer fabrication facility can improve substantially.

Modutek Provides Advanced Equipment for Manufacturers

As one of the leading semiconductor equipment manufacturers, Modutek can advise customers on how to implement a change to ozone cleaning. Modutek offers a free consultation and quote on their equipment, and ensures their equipment will support processes that meet customer requirements.

How Advanced Ozone Cleaning Reduces Chemical and Solvent Usage

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As environmental concerns mount and regulatory compliance becomes more difficult, companies that reduce the use of hazardous chemicals and solvents will have a competitive advantage. In addition to reducing costs, the use of fewer corrosive chemicals improves workplace safety and can lead to better semiconductor manufacturing facility performance. Modutek’s patented advanced ozone cleaning process saves money and reduces the contaminating particle count on wafer surfaces. Depending on process requirements, ozone cleaning can out-perform traditional wafer cleaning with harsh chemicals. Modutek’s ozone cleaning process is compact, fast, and safe.

Advanced Ozone Cleaning Converts Organic Impurities to Carbon Dioxide

Modutek has developed the Cold Strip sub ambient process that operates with deionized water and the Organostrip process that uses a mild acid at room temperature for photo resist strip. This also eliminates the use of NMP solvent base strippers. Both use ozone to clean organic contaminants from wafer surfaces and both leave harmless residues that allow for disposal without special neutralizing procedures.

The Cold Strip Advanced Ozone Cleaning Process operates at four to ten degrees centigrade and uses deionized water to strip silicon wafers of water-soluble inorganic impurities. After the wafers are rinsed with deionized water, ozone is introduced into the chamber. The ozone reacts with the remaining organic impurities and converts them to carbon dioxide. Particle contamination is reduced as well because the ozone reacts with organic particles. Wafers are more effectively cleaned with a reduced particle count.

In the Organostrip process, wafers are rinsed with a solution of a mild acid and ozone at room temperature. The acid has a high ozone solubility that lets the ozonated solution remove organic compounds from the wafer surfaces quickly and completely. The process is compatible with metals such as gold, copper, and aluminum, and the waste products of the Organostrip process are not hazardous.

Modutek uses its DryZone solvent gradient dryer for the Advanced Ozone Cleaning Process that the company developed to address customer concerns. Customers experienced high particle counts and issues with the use of hazardous chemicals, including their effect on the environment. The developed process successfully addresses these issues and delivers effective wafer cleaning.

Modutek’s Advanced Ozone Cleaning Process Provides Substantial Benefits

Modutek developed the Advanced Ozone Cleaning Process to address specific customer concerns, but the Cold Strip and Organostrip processes also improve wafer cleaning and facility operations. The benefits of using ozone cleaning include the following:

  • Reduced cost for process chemicals. The acids used in a traditional wafer cleaning process, such as sulfuric or hydrochloric acids, are expensive, and the cleaning processes such as Piranha clean use substantial volumes of chemicals. Ozone and the mild acids or solvents used in ozone clean are less expensive and the solutions last longer.
  • Reduced cost for chemical handling. The storage, delivery, and disposal of hazardous chemicals used for traditional wafer cleaning is expensive. The handling of ozone and the mild chemicals used for ozone cleaning requires no special measures.
  • Improved workplace safety. The chemical baths used for traditional wafer cleaning often operate at high temperatures and they can be dangerous. The ozone cleaning process chemicals are safe and the operation is done at sub ambient or at room temperature.
  • Higher throughput. Advanced ozone cleaning takes less time than traditional cleaning methods.
  • Improved yields. Ozone cleaning reduces particle counts and results in higher output quality with fewer product defects.

Modutek’s Continued Process Improvement Delivers Innovative Solutions for Customers

Modutek works closely with customers to identify new concerns and solve existing processing problems. Using extensive in-house experience and expertise in wet process technology allows Modutek to provide innovative solutions to meet customer needs. New wet process steps such as Advanced Ozone Cleaning can help customers improve semiconductor manufacturing facility performance and increase profitability.

How Megasonic Cleaning Improves Silicon Wafer Manufacturing

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When silicon wafers are cleaned between manufacturing steps, it is critical to remove all contamination from the wafer surfaces. The remaining traces of process chemicals or microscopic particles can disrupt the etching process and result in defective or low-quality semiconductor devices.

Megasonic cleaning uses high-frequency sound waves in the cleaning tank to remove contaminants and particles from the silicon wafers. The technology can save time and money because it works quickly and does not require expensive chemicals. Silicon wafers cleaned with Megasonic cleaning are completely clean with a reduced particle count. As a result, the technology can improve the operation of semiconductor manufacturing lines for semiconductor fabricators and research labs.

Megasonic Cleaning Reduces the Use of Toxic Chemicals

The cleaning of silicon wafers after the completion of each semiconductor manufacturing step is accomplished by soaking the wafers in mixtures of chemicals including hydrochloric acid or sulfuric acid. In addition to the cost of the chemicals themselves, there are ongoing costs related to the storage, delivery, and disposal of these chemicals. The possibility of leaks and the disposal of the waste chemicals represent environmental hazards that are continuously being mitigated with tighter regulations. Reducing the use of aggressive chemicals can save money beyond their direct cost and can improve the environmental footprint of the semiconductor manufacturing facility.

With Megasonic cleaning, a frequency generator produces an electric signal in the MHz range that is transmitted to a transducer. The transducer that is immersed in the cleaning solution converts the signal to sound waves in the cleaning tank. The sound waves create microscopic cavitation bubbles that deliver a gentle scrubbing action against the surface of the silicon wafer. The cleaning intensity is strong enough to dislodge impurities and contaminants but will not damage the wafer surface or the microscopic structures that have been etched into it.

When Megasonic cleaning is used to replace some of the traditional cleaning steps, the use of chemicals is reduced. Megasonic cleaning uses plain water or water with the addition of mild detergents. The cost benefits and reduced environmental impact can be substantial, and the areas where Megasonic cleaning is used will have increased worker safety and reduced chemical exposure.

Megasonic Cleaning Can Deliver Improved Cleaning Performance

While acid baths work well for cleaning general contaminants from silicon wafer surfaces, ensuring low particle counts can be challenging. Contaminating particles can block etching and cause defects in the final semiconductor devices. As functions become more and more closely packed on the wafer and microscopic structures become smaller, a single particle can affect the etched shapes and current paths. A key factor for improving output quality and reducing defects is reducing particle counts to a minimum.

Microscopic particles can be difficult to remove from the surface of silicon wafers because they often develop a static charge that allows them to cling to the wafer. Chemicals can dissolve the substances that make the particle adhere to the wafer surface but the static charge often remains as an additional bond. With Megasonic cleaning, very small cavitation bubbles form and collapse in tune with the sound wave frequency in the MHz range. When a bubble collapses near the wafer surface, it emits a powerful jet that dislodges any particle still clinging to the surface. Wafers that have been cleaned with Megasonic cleaning systems have a lower particle count as well as a high degree of cleanliness.

Modutek Can Help with Megasonic Cleaning Integration

As a leading manufacturer of wet process semiconductor manufacturing equipment, Modutek can help customers integrate Megasonic cleaning into their wafer cleaning process. Modutek offers free consultation and can show customers how to realize the benefits of lower costs, better output quality, and improved yields.

How Specialized Equipment Improves Wafer Cleaning Results

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When equipment is specially designed for a specific cleaning process, residue and particle removal from wafers can be improved. A better wafer cleaning process reduces semiconductor defects and can result in improved output quality. Specialized equipment can clean more quickly, allowing higher facility throughput. Specialized and customized equipment can be adapted for batch processing, continuous manufacturing or prototyping, improving production line performance, and reducing costs.

Specialized Equipment Delivers Specific Advantages

Modutek has developed specialized equipment that addresses issues with specific semiconductor manufacturing processes. Resulting advantages include better control of process variables, more efficient cleaning, reduced space requirements, and more flexible automation. While standard solutions are also available and are sometimes sufficient, the specialized equipment will deliver superior results in specific cases.

Piranha Etch Clean is often used for post-etch clean and for the removal of organic matter. Modutek has implemented a specialized control strategy that gives more reliable cleaning results while cutting chemical costs. The “bleed and feed” method provides tight control of temperature and chemical concentration to deliver superior cleaning performance.

A wafer cleaning process used in semiconductor manufacturing such as Piranha Clean has to take place in special tanks that are impervious to the process chemicals. Modutek’s heated quartz tanks minimize particle contamination while delivering precise temperature control. They are available in recirculating and constant temperature models are made from boron-free virgin fused quartz.

For many process steps, wafers must be carefully rinsed after cleaning. Modutek’s specialized quick dump rinsers minimize rinsing time while reducing the consumption of deionized water. Modutek’s specialized design has eliminated particle entrapment by reducing particle contamination at the rinsing stage.

After rinsing, wafers have to be dried while limiting additional particle contamination. Modutek offers IPA vapor drying stations but has developed a specialized single-chamber unit that rinses and dries the wafers without moving them to a new station. Moving the wafers exposes them to additional particle contamination and the single chamber IPA vapor dryer features extremely low particle counts.

As microscopic structures on silicon wafers become smaller and more tightly packed, a reduced particle count becomes critical for some wafer processes. Modutek’s use of Megasonic cleaning uses high-frequency sound waves in a cleaning solution to remove almost all remaining particles on wafer surfaces. The cavitation bubbles created by the sound waves can dislodge even the smallest particles, delivering an almost completely particle-free wafer.

Specialized Software Control for Automation

To control the wafer cleaning process, specialized software and automation can help deliver exactly the cleaning chemicals required while eliminating human error. Modutek uses its own SolidWorks Simulation Professional and Flow Simulation software and can adapt the programs to any process. Modutek’s wet bench stations are available in manual, semi-automatic, and fully automated versions with the automation designed to support the latest wet process technology. The specialized automation can be customized for specific applications to satisfy customer process requirements.

How Modutek’s Specialized Equipment Improves Performance

Specialized equipment can reduce particle counts, improve cleaning, reduce costs and increase production capacity. Modutek works closely with customers in a variety of industries and develops specialized wafer cleaning equipment to meet their unique needs. When additional customization is needed, Modutek can adapt equipment and software as required. Because the company designs and builds its products in-house, it can make the changes needed itself without relying on third parties.

With Modutek’s specialized equipment, customers ranging from large semiconductor manufacturers to small research labs can achieve excellent production results, especially after the additional customization that Modutek can provide. Superior wafer cleaning performance impacts all aspects of semiconductor manufacturing, from initial prototyping to full production line fabrication. Modutek can help with the choice of specialized equipment, suggest customizations, and ensure that the delivered equipment meets expectations.

Improving Standard Clean Particle Removal in a Wet Bench Process

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When silicon wafer yields are not improved with the Standard Clean process, improved particle removal can be achieved with advanced processing equipment. Standard Clean or RCA clean was developed by the RCA company in 1965 and it has changed little since then. It has always been successful in cleaning wafers and removing most particles. However, with silicon circuits and structures decreasing in size and product density on wafers increasing, even the tiniest particles can cause device defects.

RCA clean works by first dissolving and removing organic materials from the surface of the wafers using powerful chemicals. In a second step, metallic impurities are removed and the wafer is rinsed clean. The two-step process and the rinsing remove most particles but the smallest particles often remain attached to the wafer with surface tension and electrostatic charges. Such particles can affect diffusion in wafers or block the etching of electronic structures or circuit paths.

The submicron particles are hard to remove completely with chemicals or by rinsing. The use of megasonic cleaning technology to generate very high-frequency sound waves in the wafer bath provides the capability to dislodge all remaining particles, allowing them to be rinsed away. Megasonic cleaning improves Standard Clean particle removal process and helps ensure defect-free production of microscopic structures on the silicon wafer.

How Megasonic Cleaning Works to Improve Standard Clean Particle Removal

The two steps making up the RCA wafer cleaning process are SC1, using a mixture of ammonium hydroxide and hydrogen peroxide, and SC2, using a mixture of hydrochloric acid and hydrogen peroxide. The SC1 process removes most of the contamination from the silicon wafer surface, but introduces metallic ion contaminants that can influence subsequent wafer processing steps. The SC2 process dissolves the remaining contaminants, allowing impurities to be rinsed away as they float to the surface of the cleaning mixture.

Standard Clean takes place in heated inert tanks such as quartz baths that are carefully designed to limit additional contamination. The chemical mixtures are heated to about 80 degrees centigrade and processing takes about 10 minutes for each step. After rinsing, the silicon wafers are clean but may still have an unacceptable number of submicron particles adhering to the wafer surfaces.

Megasonic cleaning can remove the majority of these particles while also dislodging the few larger particles that may still be present. The process involves adding a megasonic transducer to the tank holding the wafers. The transducer converts very high-frequency signals from a megasonic generator into sound waves that travel through the rinsing water to strike the wafer surfaces. Sound wave frequencies are typically at or above 1 MHz but may range as low as 200 kHz depending on the specific cleaning application.

As the sound waves travel through water, they create microscopic cavitation bubbles that form and burst in tune with the sound wave frequency. When the bubbles burst, they produce tiny but intense jets of water. The jets from the bubbles near the wafer surfaces dislodge any remaining particles, leaving them to be rinsed away at the surface of the bath, for example via an overflow weir. The additional Megasonic Cleaning step is very effective in particle removal because the tiny jets break any bonds that make the particles adhere to the wafer. The result is extremely low particle counts on wafers that undergo both the RCA wafer cleaning process and Megasonic Cleaning.

Modutek Designs and Builds Specialized Equipment to Improve Wet Bench Processes

Megasonic Cleaning is one example of Modutek’s implementation of designs and technologies that improve wet process performance for their customers. For over forty years Modutek has been providing specialized semiconductor manufacturing equipment to meet unique industry needs. As a leading semiconductor equipment manufacturer, the company offers free consulting and can provide recommendations on equipment from its complete product lines. When Modutek supplies wet bench equipment to customers, the company follows a well-defined process to ensure their equipment performance meets customer requirements.