Safely Controlling the Silicon Nitride Etching Process
Silicon nitride etch removes silicon nitride from silicon wafers during the fabrication process of semiconductor components. A solution of phosphoric acid in water etches silicon nitride rapidly and consistently as long as the temperature of the solution and the concentration of phosphoric acid are kept constant. Maintaining consistent process conditions during the silicon nitride wet […]
How Quick Dump Rinsers Improve Silicon Wet Etching Results
Manufacturing lines in semiconductor fabrication facilities and research labs use corrosive chemicals to clean and etch silicon wafers. Depending on the semiconductor product, a silicon wafer may undergo multiple steps in baths containing chemicals such as hydrochloric acid or hydrogen peroxide. When the cleaning or etching process in a particular fabrication step is complete, the […]
Selecting Silicon Wet Etching Equipment for Your Application
Silicon wet etching equipment is required in the manufacture of semiconductor components and selecting the right equipment is essential for maintaining facility performance and excellent product quality. The products produced from these facilities range from relatively simple electronic parts to complex components with intricate microstructures and an electronic/physical structure interaction. These varying requirements mean that […]
How New Equipment Has Improved the Silicon Nitride Wet Etching Process
The silicon nitride wet etching process is difficult to control safely but is a key component of semiconductor wafer manufacturing. The process uses phosphoric acid to remove silicon nitride masks from silicon wafers to allow the clean wafers to undergo further fabrication steps. The hot phosphoric acid and water mixture is unstable and requires periodic addition of […]
How Silicon Wet Etching Processes Are Improved with Specialized Equipment
While Modutek’s wet bench equipment supports all common wet etching processes, the continuous development of new wet bench technologies allows the company to offer specialized equipment that can improve performance for specific applications. Key factors for high output quality, fast processing, high yields and reliable outcomes are cleanliness, repeatability, tight control and precise dosages. Modutek’s […]
Why Teflon Tanks Are Used with the KOH Etching Process
KOH etching is a preferred silicon wafer fabrication method because it works rapidly and reliably while handling of the chemicals is relatively safe. The process relies on a contamination-free environment and uses the temperature and KOH concentration to control the etching speed. Teflon tanks are used in this process because the Teflon is stable and […]
How the Silicon Nitride Wet Etching Process is Improved by Modutek
Silicon nitride is used as a mask when etching silicon wafers during the semiconductor manufacturing process. Before the silicon wafer can be processed further, the silicon nitride has to be removed. A solution of phosphoric acid and de-ionized water etches the silicon nitride while leaving the wafer unaffected. As a result, the silicon nitride is […]
How to Improve Your Silicon Wet Etching Process
Semiconductor research labs and fabrication facilities employ high-precision silicon wet etching processes that are capable of delivering quality product in a consistent way. This is no mean feat: the microscopic structures etched on semiconductor wafers require processes that meet microscopic tolerances while reducing the minutest of impurities. Fabs are always on the lookout for improvements […]
How Teflon Tanks Are Used in Wet Processing Applications
Modutek’s Teflon tanks are custom designed for use in new and existing wet processing stations. Their modular configuration allows easy integration in customer clean room facilities. Advanced PFA Teflon welding techniques reduce impurities and unwanted by-products in the process, and Modutek can supply heated models for use in processes that require temperature control. Standard carrier […]