How Optimum Particle Reduction is Achieved in a Wet Bench Process
When microscopic particles remain on the surface of silicon wafers during a wet bench process, the resulting semiconductor products may be of reduced quality or even defective. As semiconductor geometries and microscopic structures become smaller and are packed more densely on a silicon wafer, the presence of particles can influence the etch rate around the […]
How Megasonic Cleaning Improves Silicon Wafer Manufacturing
When silicon wafers are cleaned between manufacturing steps, it is critical to remove all contamination from the wafer surfaces. The remaining traces of process chemicals or microscopic particles can disrupt the etching process and result in defective or low-quality semiconductor devices. Megasonic cleaning uses high-frequency sound waves in the cleaning tank to remove contaminants and […]