How the Advanced Ozone Cleaning Process Improves Wafer Yields and Reduces Costs
Editor’s Note: This article was originally published in January 2017 and has been updated with additional information and reposted in April 2023. Modutek’s advanced ozone cleaning is a highly effective method for removing contaminants from wafers. The process involves using ozone gas, which is a highly reactive oxidant, to break down and remove organic and […]
How Advanced Ozone Cleaning Reduces Chemical and Solvent Usage
As environmental concerns mount and regulatory compliance becomes more difficult, companies that reduce the use of hazardous chemicals and solvents will have a competitive advantage. In addition to reducing costs, the use of fewer corrosive chemicals improves workplace safety and can lead to better semiconductor manufacturing facility performance. Modutek’s patented advanced ozone cleaning process saves […]
Using the Advanced Ozone Cleaning Process to Improve Wafer Yields
Two key goals for semiconductor manufacturers are to increase process yields and to reduce chemical usage. Wet process semiconductor manufacturing is sensitive to wafer contamination by microscopic particles that increase final product rejection rates and reduce output quality. The ozone cleaning process can reduce particle counts and improve wafer yields by reducing the number of defective products. […]