Megasonic Cleaning Equipment
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Modutek’s Megasonic Cleaning Equipment offers a precision cleaning system developed for unique requirements for the Semiconductor, FPD, Hard Disk, Solar, and Crystal industries. We work directly with Kaijo Corporation, the world leader in Megasonic cleaning systems technology. This gives us the opportunity to offer the latest Megasonic cleaning advances like the new Kaijo Quava Megasonic cleaning system generator.
Modutek’s Megasonic Cleaning Equipment offers a precision cleaning system developed for unique requirements for the Semiconductor, FPD, Hard Disk, Solar, and Crystal industries. We work directly with Kaijo Corporation, the world leader in Megasonic cleaning systems technology. This gives us the opportunity to offer the latest Megasonic cleaning advances like the new Kaijo Quava Megasonic cleaning system generator.
With our Indirect (MSI Series) bath design, you have the ability to remove 0.1 µm particles and operate at temperatures up to 140˚C. Our Direct (MSD Series) gives you the same results as our Teflon-coated Megasonic transducer. The transducer plate is located directly in the tank for quick installation or upgrades. This is ideal for SC1 applications and has a temperature rating of 70˚C maximum. In either case, our engineers work with you to design the most efficient Megasonic cleaning system for your application.
Benefits
- Precision Control - Programmable spray, rotation, and chemical delivery
- Flexible Materials - 316L stainless steel or FM-4910 construction options
- Factory Automation - SECS/GEM interface with data logging and lot tracking
- Enhanced Safety - CO₂ suppression and dual containment design
- Minimized Downtime - Ergonomic access and comprehensive service support
- Versatile Chemistry - Single-pass or recirculation with megasonic technology
- Cost-Effective - Reduced chemical consumption and modular design
- Full Traceability - Complete parameter logging for compliance
Features
- Wafer Capacity - Up to 300mm, development to production scale
- Construction - 316L stainless steel or FM-4910 with dual containment
- Process Control - Servo spray nozzles with programmable parameters
- Chemistry System - Megasonic shower head with adjustable flow
- Automation - PLC touchscreen with SECS/GEM integration
- Loading - Automated or manual front-access cassette handling
- Safety - CO₂ suppression, nitrogen, and DI spray guns
- Throughput - Multiple spray chamber configurations available
Specifications
System Configuration
- Up to 300mm wafer capacity
- Development, pilot, and production configurations
- 316L stainless steel or FM-4910 materials
- Automated or manual loading
Process Control
- High-accuracy rotation control
- Servo-controlled oscillating spray nozzles
- Variable chemical flow and pressure
- Adjustable nozzle-to-wafer distance
- Megasonic shower head options
Automation
- PLC with color touchscreen
- SECS/GEM interface
- Parameter data logging
- PC-based lot tracking
Safety
- CO₂ fire suppression
- Dual containment design
- Rear access maintenance area
- Nitrogen and DI spray guns
Applications
RCA and Pre-Clean
- SC1 and SC2 cleaning
- Pre-diffusion cleaning
- Post-CMP cleaning
Etch and Conditioning
- Nitride etch
- HF, DHF, and BOE oxide etching
- KOH and TMAH silicon etching
- Surface preparation
Resist Strip
- Photoresist stripping
- Implant resist strip
- Post-etch resist strip
- Metal lift-off
Benefits
- Precision Control - Programmable spray, rotation, and chemical delivery
- Flexible Materials - 316L stainless steel or FM-4910 construction options
- Factory Automation - SECS/GEM interface with data logging and lot tracking
- Enhanced Safety - CO₂ suppression and dual containment design
- Minimized Downtime - Ergonomic access and comprehensive service support
- Versatile Chemistry - Single-pass or recirculation with megasonic technology
- Cost-Effective - Reduced chemical consumption and modular design
- Full Traceability - Complete parameter logging for compliance
Features
- Wafer Capacity - Up to 300mm, development to production scale
- Construction - 316L stainless steel or FM-4910 with dual containment
- Process Control - Servo spray nozzles with programmable parameters
- Chemistry System - Megasonic shower head with adjustable flow
- Automation - PLC touchscreen with SECS/GEM integration
- Loading - Automated or manual front-access cassette handling
- Safety - CO₂ suppression, nitrogen, and DI spray guns
- Throughput - Multiple spray chamber configurations available
Specifications
System Configuration
- Up to 300mm wafer capacity
- Development, pilot, and production configurations
- 316L stainless steel or FM-4910 materials
- Automated or manual loading
Process Control
- High-accuracy rotation control
- Servo-controlled oscillating spray nozzles
- Variable chemical flow and pressure
- Adjustable nozzle-to-wafer distance
- Megasonic shower head options
Automation
- PLC with color touchscreen
- SECS/GEM interface
- Parameter data logging
- PC-based lot tracking
Safety
- CO₂ fire suppression
- Dual containment design
- Rear access maintenance area
- Nitrogen and DI spray guns
Applications
RCA and Pre-Clean
- SC1 and SC2 cleaning
- Pre-diffusion cleaning
- Post-CMP cleaning
Etch and Conditioning
- Nitride etch
- HF, DHF, and BOE oxide etching
- KOH and TMAH silicon etching
- Surface preparation
Resist Strip
- Photoresist stripping
- Implant resist strip
- Post-etch resist strip
- Metal lift-off
Benefits
Benefits
- Precision Control - Programmable spray, rotation, and chemical delivery
- Flexible Materials - 316L stainless steel or FM-4910 construction options
- Factory Automation - SECS/GEM interface with data logging and lot tracking
- Enhanced Safety - CO₂ suppression and dual containment design
- Minimized Downtime - Ergonomic access and comprehensive service support
- Versatile Chemistry - Single-pass or recirculation with megasonic technology
- Cost-Effective - Reduced chemical consumption and modular design
- Full Traceability - Complete parameter logging for compliance
Features
Features
- Wafer Capacity - Up to 300mm, development to production scale
- Construction - 316L stainless steel or FM-4910 with dual containment
- Process Control - Servo spray nozzles with programmable parameters
- Chemistry System - Megasonic shower head with adjustable flow
- Automation - PLC touchscreen with SECS/GEM integration
- Loading - Automated or manual front-access cassette handling
- Safety - CO₂ suppression, nitrogen, and DI spray guns
- Throughput - Multiple spray chamber configurations available
Specifications
Specifications
System Configuration
- Up to 300mm wafer capacity
- Development, pilot, and production configurations
- 316L stainless steel or FM-4910 materials
- Automated or manual loading
Process Control
- High-accuracy rotation control
- Servo-controlled oscillating spray nozzles
- Variable chemical flow and pressure
- Adjustable nozzle-to-wafer distance
- Megasonic shower head options
Automation
- PLC with color touchscreen
- SECS/GEM interface
- Parameter data logging
- PC-based lot tracking
Safety
- CO₂ fire suppression
- Dual containment design
- Rear access maintenance area
- Nitrogen and DI spray guns
Applications
Applications
RCA and Pre-Clean
- SC1 and SC2 cleaning
- Pre-diffusion cleaning
- Post-CMP cleaning
Etch and Conditioning
- Nitride etch
- HF, DHF, and BOE oxide etching
- KOH and TMAH silicon etching
- Surface preparation
Resist Strip
- Photoresist stripping
- Implant resist strip
- Post-etch resist strip
- Metal lift-off
Contact us if you need more information on how our Megasonic Cleaning Equipment can improve your processing results.