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Archive: March 2021
Using the Advanced Ozone Cleaning Process to Improve Wafer Yields
Two key goals for semiconductor manufacturers are to increase process yields and to reduce chemical usage. Wet process semiconductor manufacturing is sensitive to wafer contamination by microscopic particles that increase…
Read More →
Achieving Optimum Particle Removal in a Wet Bench Process
As component packing is tighter and circuit geometries trend towards smaller structures, the reduction of submicron particle contamination during the wet bench process steps becomes more important for output quality.…
Read More →Latest Posts
Categories
Archives
Archive: March 2021
Using the Advanced Ozone Cleaning Process to Improve Wafer Yields
Two key goals for semiconductor manufacturers are to increase process yields and to reduce chemical usage. Wet process semiconductor manufacturing is sensitive to wafer contamination by microscopic particles that increase…
Read More →
Achieving Optimum Particle Removal in a Wet Bench Process
As component packing is tighter and circuit geometries trend towards smaller structures, the reduction of submicron particle contamination during the wet bench process steps becomes more important for output quality.…
Read More →